The MC100EP196B is a Programmable Delay Chip (PDC) designed primarily for clock deskewing and timing adjustment. It provides variable delay of a differential NECL/PECL input transition. It has similar architecture to the EP195 with the added feature of further tunability in delay using the FTUNE pin. The FTUNE input takes an analog voltage from VCC to VEE to fine tune the output delay from 0 to 60 ps. The delay section consists of a programmable matrix of gates and multiplexers as shown in the logic diagram, Figure 2. The delay increment of the EP196B has a digitally selectable resolution of about 10 ps and a net range of up to 10.4 ns. The required delay is selected by the 10 data select inputs D(9:0) values and controlled by the LEN (pin 10). A LOW level on LEN allows a transparent LOAD mode of real time delay values by D(9:0). A LOW to HIGH transition on LEN will LOCK and HOLD current values present against any subsequent changes in D(10:0). The approximate delay values for varying tap numbers correlating to D0 (LSB) through D9 (MSB) are shown in Table 6 and Figure 3.
Features
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Applications
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Document Title | Document ID/Size | Revision | Revision Date |
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AC Characteristics of ECL Devices | AND8090/D (896.0kB) | 1 | |
Clock Generation and Clock and Data Marking and Ordering Information Guide | AND8002/D (71kB) | 12 | |
Designing with PECL (ECL at +5.0 V) | AN1406/D (105.0kB) | 2 | |
ECL Clock Distribution Techniques | AN1405/D (54.0kB) | 1 | |
ECLinPS, ECLinPS Lite, ECLinPS Plus and GigaComm Marking and Ordering Information Guide | AND8002 (71kB) | 12 | |
Interfacing Between LVDS and ECL | AN1568/D (121.0kB) | 11 | |
Interfacing with ECLinPS | AND8066/D (72kB) | 3 | |
Odd Number Divide By Counters with 50% Outputs and Synchronous Clocks | AND8001/D (90.0kB) | 0 | |
Phase Lock Loop General Operations | AND8040/D (64.0kB) | 3 | |
Storage and Handling of Drypack Surface Mount Device | AND8003/D (49kB) | 2 | Mar, 2016 |
Termination of ECL Logic Devices | AND8020/D (176.0kB) | 6 | |
The ECL Translator Guide | AN1672/D (142.0kB) | 12 | |
Thermal Analysis and Reliability of WIRE BONDED ECL | AND8072/D (119.0kB) | 5 | |
Using Wire-OR Ties in ECLInPS™ Designs | AN1650/D (1130.0kB) | 3 |
Document Title | Document ID/Size | Revision | Revision Date |
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3.3 V ECL Programmable Delay Chip With FTUNE | MC100EP196B/D (159kB) | 2 |
Document Title | Document ID/Size | Revision | Revision Date |
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IBIS Model for MC100EP196FA | MC100EP196FA_33V_ECL.IBS (0.0kB) |
Document Title | Document ID/Size | Revision |
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QFN32, 5x5, 0.5P, 3.1x3.1EP | 488AM (57.4kB) | A |
Product | Status | Compliance | Package | MSL* | Container | Budgetary Price/Unit | ||
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MC100EP196BFAG | Active | Pb-free Halide free | LQFP-32 | Contact BDTIC | 2 | Tray JEDEC | 250 | Contact BDTIC |
MC100EP196BFAR2G | Lifetime | Pb-free Halide free | LQFP-32 | Contact BDTIC | 2 | Tape and Reel | 2000 | |
MC100EP196BMNG | Active | Pb-free Halide free | QFN-32 | 488AM | 2 | Tube | 74 | Contact BDTIC |
MC100EP196BMNR4G | Lifetime | Pb-free Halide free | QFN-32 | 488AM | 2 | Tape and Reel | 1000 |
Product | Input Level | Output Level | VCC Typ (V) | fMax Typ (MHz) | td(prog) Min (ns) | td(prog) Max (ns) | td(step) Typ (ps) | tJitter Typ (ps) | tR & tF Max (ps) |
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MC100EP196BFAG | CML ECL LVDS | ECL | 3.3 | 1200 | 8.95 | 12.11 | 11 | 1.1 2.6 | 210 140 |
MC100EP196BMNG | CML LVDS ECL | ECL | 3.3 | 1200 | 8.95 | 12.11 | 11 | 2.6 1.1 | 140 210 |