MC100EP31: ECL D Flip-Flop with Set and Reset

The MC10/100EP31 is a D flip-flop with set and reset. The device is pin and functionally equivalent to the EL31 and LVEL31 devices. With AC performance much faster than the EL31 and LVEL31 devices, the EP31 is ideal for applications requiring the fastest AC performance available. Both set and reset inputs are asynchronous, level triggered signals. Data enters the master portion of the flip-flop when CLK is low and is transferred to the slave, and thus the outputs, upon a positive transition of the CLK.The 100 Series contains temperature compensation.

Features
  • 340ps Typical Propagation Delay
  • Maximum Frequency > 3 GHz Typical
  • PECL Mode Operating Range: VCC= 3.0 V to 5.5 Vwith VEE= 0 V
  • NECL Mode Operating Range: VCC= 0 Vwith VEE= –3.0 V to –5.5 V
  • Open Input Default State
  • Q Output will default LOW with inputs open or at VEE
  • Pb-Free Packages are Available
Applications
  • Clock Distribution
Application Notes (16)
Document TitleDocument ID/SizeRevisionRevision Date
AC Characteristics of ECL DevicesAND8090/D (896.0kB)1
Clock Generation and Clock and Data Marking and Ordering Information GuideAND8002/D (71kB)12
Designing with PECL (ECL at +5.0 V)AN1406/D (105.0kB)2
ECL Clock Distribution TechniquesAN1405/D (54.0kB)1
ECLinPS Plus™ Spice Modeling KitAND8009/D (343.0kB)11
ECLinPS, ECLinPS Lite, ECLinPS Plus and GigaComm Marking and Ordering Information GuideAND8002 (71kB)12
Interfacing Between LVDS and ECLAN1568/D (121.0kB)11
Interfacing with ECLinPSAND8066/D (72kB)3
Metastability and the ECLinPS FamilyAN1504/D (103.0kB)3
Odd Number Divide By Counters with 50% Outputs and Synchronous ClocksAND8001/D (90.0kB)0
Phase Lock Loop General OperationsAND8040/D (64.0kB)3
Storage and Handling of Drypack Surface Mount DeviceAND8003/D (49kB)2Mar, 2016
Termination of ECL Logic DevicesAND8020/D (176.0kB)6
The ECL Translator GuideAN1672/D (142.0kB)12
Thermal Analysis and Reliability of WIRE BONDED ECLAND8072/D (119.0kB)5
Using Wire-OR Ties in ECLInPS™ DesignsAN1650/D (1130.0kB)3
Data Sheets (1)
Document TitleDocument ID/SizeRevisionRevision Date
3.3 V / 5V ECL D Flip-Flop with Set and ResetMC10EP31/D (177kB)11Aug, 2016
Simulation Models (1)
Document TitleDocument ID/SizeRevisionRevision Date
IBS Model for MC100EP31DT_33MC100EP31DT_33.IBS (5.0kB)2
Package Drawings (3)
Document TitleDocument ID/SizeRevision
DFN8 2.0x2.0x0.9mm, 0.5p506AA (31.8kB)F
SOIC-8 Narrow Body751-07 (62.6kB)AK
TSSOP 8 3.0x3.0x0.95 mm948R-02 (77.3kB)A
Order Information
ProductStatusCompliancePackageMSL*ContainerBudgetary Price/Unit
MC100EP31DGActivePb-free Halide freeSOIC-8751-071Tube98Contact BDTIC
MC100EP31DR2GLifetimePb-free Halide freeSOIC-8751-071Tape and Reel2500
MC100EP31DTGActivePb-free Halide freeTSSOP-8948R-023Tube100Contact BDTIC
MC100EP31DTR2GActivePb-free Halide freeTSSOP-8948R-023Tape and Reel2500Contact BDTIC
MC100EP31MNR4GLast ShipmentsPb-free Halide freeDFN-8506AA1Tape and Reel1000
Specifications
ProductTypeBitsInput LevelOutput LevelVCC Typ (V)tJitter Typ (ps)tpd Typ (ns)tsu Min (ns)th Min (ns)trec Typ (ns)tR & tF Max (ps)fToggle Typ (MHz)
MC100EP31DGD-Type1ECL CMLECL5 3.30.20.340.10.150.2251803000
MC100EP31DTGD-Type1CML ECLECL3.3 50.20.340.10.150.2251803000
MC100EP31DTR2GD-Type1CML ECLECL5 3.30.20.340.10.150.2251803000
3.3 V / 5V ECL D Flip-Flop with Set and Reset (177kB) MC10EP31
AC Characteristics of ECL Devices NB100LVEP91
Clock Generation and Clock and Data Marking and Ordering Information Guide NB100LVEP91
Designing with PECL (ECL at +5.0 V) NB100LVEP91
ECL Clock Distribution Techniques NB100LVEP91
ECLinPS Plus™ Spice Modeling Kit MC10EPT20
ECLinPS, ECLinPS Lite, ECLinPS Plus and GigaComm Marking and Ordering Information Guide NB100LVEP91
Interfacing Between LVDS and ECL NB100ELT23L
Interfacing with ECLinPS NB100LVEP91
Metastability and the ECLinPS Family MC10EPT20
Odd Number Divide By Counters with 50% Outputs and Synchronous Clocks NUP4201
Phase Lock Loop General Operations MC10H604
Storage and Handling of Drypack Surface Mount Device NB3U23C
Termination of ECL Logic Devices NB100LVEP91
The ECL Translator Guide NB100LVEP91
Thermal Analysis and Reliability of WIRE BONDED ECL NB100LVEP91
Using Wire-OR Ties in ECLInPS™ Designs MC10H351
IBS Model for MC100EP31DT_33 MC100EP31
SOIC-8 Narrow Body CM1216
TSSOP 8 3.0x3.0x0.95 mm NB100ELT23L
DFN8 2.0x2.0x0.9mm, 0.5p NUF4220