MC100LVE310: Clock / Data Fanout Buffer, 2:8 Differential, ECL, 3.3 V

The MC100LVE310 is a low voltage, low skew 2:8 differential ECL fanout buffer designed with clock distribution in mind. The device features fully differential clock paths to minimize both device and system skew. The LVE310 offers two selectable clock inputs to allow for redundant or test clocks to be incorporated into the system clock trees. To ensure that the tight skew specification is met it is necessary that both sides of the differential output are terminated into 50, even if only one side is being used. In most applications all eight differential pairs will be used and therefore terminated. In the case where fewer than eight pairs are used it is necessary to terminate at least the output pairs adjacent to the output pair being used in order to maintain minimum skew. Failure to follow this guideline will result in small degradations of propagation delay (on the order of 10-20 ps) of the outputs being used, while not catastrophic to most designs this will result in an increase in skew. Note that the package corners isolate outputs from one another such that the guideline expressed above holds only for outputs on the same side of the package. The MC100LVE310, as with most ECL devices, can be operated from a positive VCC supply in LVPECL mode. This allows the LVE310 to be used for high performance clock distribution in +3.3 V systems. Designers can take advantage of the LVE310's performance to distribute low skew clocks across the backplane or the board. In a PECL environment series or Thevenin line terminations are typically used as they require no additional power supplies, if parallel termination is desired a terminating voltage of VCC-2.0 V will need to be provided. For more information on using PECL, designers should refer to Application Note AN1406/D. The VBB pin, an internally generated voltage supply, is available to this device only. For single-ended input conditions, the unused differential input is connecte

Features
  • 200ps Part-to-Part Skew
  • 50ps Output-to-Output Skew
  • The 100 Series Contains Temperature Compensation
  • ESD Protection: >2 KV HBM, >200 V MM
  • PECL Mode Operating Range: VCC = 3.0 V to 3.8 V with VEE = 0 V
  • NECL Mode Operating Range: VCC = 0 V with VEE = -3.0 V to -3.8 V
  • Internal Input Pulldown Resistors
  • Q Output will Default LOW with All Inputs Open or at VEE
  • Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
  • Moisture Sensitivity Level 1For Additional Information, see Application Note AND8003/D
  • Flammability Rating: UL-94 code V-0 @ 1/8", Oxygen Index 28 to 34
  • Transistor Count = 212 devices
  • Pb-Free Packages are Available
Application Notes (15)
Document TitleDocument ID/SizeRevisionRevision Date
AC Characteristics of ECL DevicesAND8090/D (896.0kB)1
Clock Generation and Clock and Data Marking and Ordering Information GuideAND8002/D (71kB)12
Clock Management Design Using Low Skew and Low Jitter DevicesTND301/D (205.0kB)0
Designing with PECL (ECL at +5.0 V)AN1406/D (105.0kB)2
ECL Clock Distribution TechniquesAN1405/D (54.0kB)1
ECLinPS, ECLinPS Lite, ECLinPS Plus and GigaComm Marking and Ordering Information GuideAND8002 (71kB)12
Interfacing Between LVDS and ECLAN1568/D (121.0kB)11
Interfacing with ECLinPSAND8066/D (72kB)3
Odd Number Divide By Counters with 50% Outputs and Synchronous ClocksAND8001/D (90.0kB)0
Phase Lock Loop General OperationsAND8040/D (64.0kB)3
Storage and Handling of Drypack Surface Mount DeviceAND8003/D (49kB)2Mar, 2016
Termination of ECL Logic DevicesAND8020/D (176.0kB)6
The ECL Translator GuideAN1672/D (142.0kB)12
Thermal Analysis and Reliability of WIRE BONDED ECLAND8072/D (119.0kB)5
Using Wire-OR Ties in ECLInPS™ DesignsAN1650/D (1130.0kB)3
Data Sheets (1)
Document TitleDocument ID/SizeRevisionRevision Date
3.3 V ECL 2:8 Differential Fanout BufferMC100LVE310/D (152kB)6Jul, 2016
Simulation Models (2)
Document TitleDocument ID/SizeRevisionRevision Date
IBIS Model for MC100LVE310FN for 3.3VMC100LVE310FN_33.IBS (6.0kB)3
Low Voltage ECLinPS SPICE Modeling KitAN1560/D (88.0kB)5
Package Drawings (1)
Document TitleDocument ID/SizeRevision
28 LEAD PLCC776-02 (67.7kB)F
Order Information
ProductStatusCompliancePackageMSL*ContainerBudgetary Price/Unit
MC100LVE310FNGActivePb-free Halide freePLCC-28776-023Tube37Contact BDTIC
MC100LVE310FNR2GActivePb-free Halide freePLCC-28776-023Tape and Reel500Contact BDTIC
Specifications
ProductTypeChannelsInput / Output RatioInput LevelOutput LevelVCC Typ (V)tJitterRMS Typ (ps)tskew(o-o) Max (ps)tpd Typ (ns)tR & tF Max (ps)fmaxClock Typ (MHz)fmaxData Typ (Mbps)
MC100LVE310FNGBuffer12:1:8ECLECL3.31.5750.656001000
MC100LVE310FNR2GBuffer12:1:8ECLECL3.31.5750.656001000
3.3 V ECL 2:8 Differential Fanout Buffer (152kB) MC100LVE310
AC Characteristics of ECL Devices NB100LVEP91
Clock Generation and Clock and Data Marking and Ordering Information Guide NB100LVEP91
Clock Management Design Using Low Skew and Low Jitter Devices MC10H604
Designing with PECL (ECL at +5.0 V) NB100LVEP91
ECL Clock Distribution Techniques NB100LVEP91
ECLinPS, ECLinPS Lite, ECLinPS Plus and GigaComm Marking and Ordering Information Guide NB100LVEP91
Interfacing Between LVDS and ECL NB100ELT23L
Interfacing with ECLinPS NB100LVEP91
Odd Number Divide By Counters with 50% Outputs and Synchronous Clocks NUP4201
Phase Lock Loop General Operations MC10H604
Storage and Handling of Drypack Surface Mount Device NB3U23C
Termination of ECL Logic Devices NB100LVEP91
The ECL Translator Guide NB100LVEP91
Thermal Analysis and Reliability of WIRE BONDED ECL NB100LVEP91
Using Wire-OR Ties in ECLInPS™ Designs MC10H351
IBIS Model for MC100LVE310FN for 3.3V MC100LVE310
Low Voltage ECLinPS SPICE Modeling Kit MC100LVELT23
28 LEAD PLCC MC10H604