MC10EL15: Clock Distribution Chip, 1:4, ECL, 5.0 V

The MC10EL/100EL15 is a low skew 1:4 clock distribution chip designed explicitly for low skew clock distribution applications. The device can be driven by either a differential or single-ended ECL or, if positive power supplies are used, PECL input signal. If a single-ended input is to be used the VBB output should be connected to the CLK input and bypassed to ground via a 0.01 F capacitor. The VBB output is designed to act as the switching reference for the input of the EL15 under single-ended input conditions, as a result this pin can only source/sink up to 0.5mA of current. The EL15 features a multiplexed clock input to allow for the distribution of a lower speed scan or test clock along with the high speed system clock. When LOW (or left open and pulled LOW by the input pulldown resistor) the SEL pin will select the differential clock input. The common enable (ENbar) is synchronous so that the outputs will only be enabled/disabled when they are already in the LOW state. This avoids any chance of generating a runt clock pulse when the device is enabled/disabled as can happen with an asynchronous control. The internal flip flop is clocked on the falling edge of the input clock, therefore all associated specification limits are referenced to the negative edge of the clock input.The 100 series contains temperature compensation.

Features
  • 50ps Output-to-Output Skew
  • Synchronous Enable/Disable
  • Multiplexed Clock Input
  • ESD Protection: > 1 KV HBM, > 100 V MM
  • PECL Mode Operating Range: VCC = 4.2 V to 5.7 V with VEE = 0 V
  • NECL Mode Operating Range: VCC = 0 V with VEE = -4.2 V to -5.7 V
  • Internal Input Pulldown Resistors on CLKs, SCLK, SEL, and ENbar.
  • Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
  • Moisture Sensitivity Level 1For Additional Information, see Application Note AND8003/D
  • Flammability Rating: UL-94 code V-0 @ 1/8", Oxygen Index 28 to 34
  • Transistor Count = 103 devices
  • Pb-Free Packages are Available
Application Notes (17)
Document TitleDocument ID/SizeRevisionRevision Date
AC Characteristics of ECL DevicesAND8090/D (896.0kB)1
Clock Generation and Clock and Data Marking and Ordering Information GuideAND8002/D (71kB)12
Clock Management Design Using Low Skew and Low Jitter DevicesTND301/D (205.0kB)0
Designing with PECL (ECL at +5.0 V)AN1406/D (105.0kB)2
ECL Clock Distribution TechniquesAN1405/D (54.0kB)1
ECLinPS and ECLinPS Lite SPICE I/O Modeling KitAN1503/D (120.0kB)6
ECLinPS, ECLinPS Lite, ECLinPS Plus and GigaComm Marking and Ordering Information GuideAND8002 (71kB)12
Interfacing Between LVDS and ECLAN1568/D (121.0kB)11
Interfacing with ECLinPSAND8066/D (72kB)3
Metastability and the ECLinPS FamilyAN1504/D (103.0kB)3
Odd Number Divide By Counters with 50% Outputs and Synchronous ClocksAND8001/D (90.0kB)0
Phase Lock Loop General OperationsAND8040/D (64.0kB)3
Storage and Handling of Drypack Surface Mount DeviceAND8003/D (49kB)2Mar, 2016
Termination of ECL Logic DevicesAND8020/D (176.0kB)6
The ECL Translator GuideAN1672/D (142.0kB)12
Thermal Analysis and Reliability of WIRE BONDED ECLAND8072/D (119.0kB)5
Using Wire-OR Ties in ECLInPS™ DesignsAN1650/D (1130.0kB)3
Data Sheets (1)
Document TitleDocument ID/SizeRevisionRevision Date
5V ECL 1:4 Clock Distribution ChipMC10EL15/D (158kB)7Jul, 2016
Simulation Models (1)
Document TitleDocument ID/SizeRevisionRevision Date
IBIS Model for MC10EL15DMC10EL15D.IBS (12.0kB)
Package Drawings (1)
Document TitleDocument ID/SizeRevision
SOIC 16 LEAD751B-05 (38.2kB)K
Order Information
ProductStatusCompliancePackageMSL*ContainerBudgetary Price/Unit
MC10EL15DGActivePb-free Halide freeSOIC-16751B-051Tube48Contact BDTIC
MC10EL15DR2GActivePb-free Halide freeSOIC-16751B-051Tape and Reel2500Contact BDTIC
Specifications
ProductTypeChannelsInput / Output RatioInput LevelOutput LevelVCC Typ (V)tJitterRMS Typ (ps)tskew(o-o) Max (ps)tpd Typ (ns)tR & tF Max (ps)fmaxClock Typ (MHz)fmaxData Typ (Mbps)
MC10EL15DGBuffer12:1:4ECLECL52.6500.575751250
MC10EL15DR2GBuffer12:1:4ECLECL52.6500.575751250
5V ECL 1:4 Clock Distribution Chip (158kB) MC10EL15
AC Characteristics of ECL Devices NB100LVEP91
Clock Generation and Clock and Data Marking and Ordering Information Guide NB100LVEP91
Clock Management Design Using Low Skew and Low Jitter Devices MC10H604
Designing with PECL (ECL at +5.0 V) NB100LVEP91
ECL Clock Distribution Techniques NB100LVEP91
ECLinPS and ECLinPS Lite SPICE I/O Modeling Kit MC100EP91
ECLinPS, ECLinPS Lite, ECLinPS Plus and GigaComm Marking and Ordering Information Guide NB100LVEP91
Interfacing Between LVDS and ECL NB100ELT23L
Interfacing with ECLinPS NB100LVEP91
Metastability and the ECLinPS Family MC10EPT20
Odd Number Divide By Counters with 50% Outputs and Synchronous Clocks NUP4201
Phase Lock Loop General Operations MC10H604
Storage and Handling of Drypack Surface Mount Device NB3U23C
Termination of ECL Logic Devices NB100LVEP91
The ECL Translator Guide NB100LVEP91
Thermal Analysis and Reliability of WIRE BONDED ECL NB100LVEP91
Using Wire-OR Ties in ECLInPS™ Designs MC10H351
IBIS Model for MC10EL15D MC10EL15
SOIC 16 LEAD MC14504B