MC10H645: 2:1:9 TTL Clock Driver

The MC10H645 is a single supply, low skew, TTL I/O 2:1:9 Clock Driver. Devices in the Motorola H600 clock driver family utiize the 28-lead PLCC for optimal power and signal pin placement. The device features a 24mA TTL ouput stage with AC performance specified into a 50pF load capacitance. A 2:1 input mux is provided on chip to allow for distributing both system and diagnostic clock signals or designing clock redundancy into a system. With the SEL input held LOW the DO input will be selected, while the D1 input is selected when the SEL input is forced HIGH.

Features
  • Low Skew Typically 0.65ns Within Device
  • Guaranteed Skew Spec 1.25ns Part-to-Part
  • Input Clock Muxing
  • Differential ECL Internal Design
  • Single Supply
  • Extra TTL and ECL Power/Ground Pins
  • Pb-Free Packages are Available
Application Notes (15)
Document TitleDocument ID/SizeRevisionRevision Date
AC Characteristics of ECL DevicesAND8090/D (896.0kB)1
Clock Generation and Clock and Data Marking and Ordering Information GuideAND8002/D (71kB)12
Clock Management Design Using Low Skew and Low Jitter DevicesTND301/D (205.0kB)0
Designing with PECL (ECL at +5.0 V)AN1406/D (105.0kB)2
ECL Clock Distribution TechniquesAN1405/D (54.0kB)1
ECLinPS, ECLinPS Lite, ECLinPS Plus and GigaComm Marking and Ordering Information GuideAND8002 (71kB)12
Family Characteristics for MECL 10H™ and MECL 10K™TND309/D (248.0kB)1
Interfacing Between LVDS and ECLAN1568/D (121.0kB)11
Interfacing with ECLinPSAND8066/D (72kB)3
Odd Number Divide By Counters with 50% Outputs and Synchronous ClocksAND8001/D (90.0kB)0
Phase Lock Loop General OperationsAND8040/D (64.0kB)3
Storage and Handling of Drypack Surface Mount DeviceAND8003/D (49kB)2Mar, 2016
Termination of ECL Logic DevicesAND8020/D (176.0kB)6
The ECL Translator GuideAN1672/D (142.0kB)12
Thermal Analysis and Reliability of WIRE BONDED ECLAND8072/D (119.0kB)5
Data Sheets (1)
Document TitleDocument ID/SizeRevisionRevision Date
2:1:9 TTL Clock DriverMC10H645/D (68kB)7
Simulation Models (1)
Document TitleDocument ID/SizeRevisionRevision Date
IBIS Model for MC10H645FNMC10H645FN.IBS (7.0kB)0
Package Drawings (1)
Document TitleDocument ID/SizeRevision
28 LEAD PLCC776-02 (67.7kB)F
Order Information
ProductStatusCompliancePackageMSL*ContainerBudgetary Price/Unit
MC10H645FNGActivePb-free Halide freePLCC-28776-023Tube37Contact BDTIC
MC10H645FNR2GLast ShipmentsPb-free Halide freePLCC-28776-023Tape and Reel500
Specifications
ProductTypeChannelsInput / Output RatioInput LevelOutput LevelVCC Typ (V)tJitterRMS Typ (ps)tskew(o-o) Max (ps)tpd Typ (ns)tR & tF Max (ps)fmaxClock Typ (MHz)fmaxData Typ (Mbps)
MC10H645FNGBuffer12:1:9TTLTTL56505.32500
2:1:9 TTL Clock Driver (68kB) MC10H645
AC Characteristics of ECL Devices NB100LVEP91
Clock Generation and Clock and Data Marking and Ordering Information Guide NB100LVEP91
Clock Management Design Using Low Skew and Low Jitter Devices MC10H604
Designing with PECL (ECL at +5.0 V) NB100LVEP91
ECL Clock Distribution Techniques NB100LVEP91
ECLinPS, ECLinPS Lite, ECLinPS Plus and GigaComm Marking and Ordering Information Guide NB100LVEP91
Family Characteristics for MECL 10H™ and MECL 10K™ MC10H604
Interfacing Between LVDS and ECL NB100ELT23L
Interfacing with ECLinPS NB100LVEP91
Odd Number Divide By Counters with 50% Outputs and Synchronous Clocks NUP4201
Phase Lock Loop General Operations MC10H604
Storage and Handling of Drypack Surface Mount Device NB3U23C
Termination of ECL Logic Devices NB100LVEP91
The ECL Translator Guide NB100LVEP91
Thermal Analysis and Reliability of WIRE BONDED ECL NB100LVEP91
IBIS Model for MC10H645FN MC10H645
28 LEAD PLCC MC10H604