NB3F8L3010C: Clock / Data Fanout Buffer, 3:1:10 Differential, LVCMOS, 3.3 V / 2.5 V / 1.8 V / 1.5 V

The NB3F8L3010C is a 3:1:10 Clock or Data fanout buffer operating on a 3.3 V or 2.5 V Core VDD and a flexible 3.3 V or 2.5 V or 1.8 V or 1.5 V VDDO supply which must be equal or less than VDD.

Features
  • Ten CMOS / LVTTL Outputs up to 200 MHz
  • Differential Inputs Accept LVPECL, LVDS, HCSL, or SSTL
  • Crystal Oscillator Interface
  • Crystal Input Frequency Range: 10 MHz to 40 MHz
  • Output Skew: 10 ps Typical
  • Additive RMS Phase Jitter @ 125 MHz, (12 kHz 20 MHz): 0.03 ps(Typical)
  • Synchronous Output Enable
  • Output Defined Level When Input is Floating
  • Pure 3.3 V or 2.5 V Operating Mode, 3.3 V Core with 2.5 V/1.8 V/1.5 V Output Supply; or 2.5 V Core with 1.8 V/1.5 V Output Supply.
Applications
  • Wireless and Wired Infrastructure
  • Networking and Data Communications
  • High-End Computing
  • Clock Distribution
End Products
  • Ethernet Switches / Routers
  • Servers
  • Test and Measurement
  • ATE
Application Notes (7)
Document TitleDocument ID/SizeRevisionRevision Date
AC Characteristics of ECL DevicesAND8090/D (896.0kB)1
Board Level Application Notes for DFN and QFN PackagesAND8211/D (175.0kB)1
Board Mounting Notes for Quad Flat-Pack No-Lead Package (QFN)AND8086/D (40.0kB)0
Clock Generation and Clock and Data Marking and Ordering Information GuideAND8002/D (71kB)12
Semiconductor Package Thermal CharacterizationAND8215/D (363.0kB)0
Storage and Handling of Drypack Surface Mount DeviceAND8003/D (49kB)2Mar, 2016
Thermal Analysis and Reliability of WIRE BONDED ECLAND8072/D (119.0kB)5
Data Sheets (1)
Document TitleDocument ID/SizeRevisionRevision Date
Fanout Buffer, 3.3V / 2.5V / 1.8V / 1.5V 3:1:10 LVCMOSNB3F8L3010C/D (108kB)7
Simulation Models (1)
Document TitleDocument ID/SizeRevisionRevision Date
NB3F8L3010C IBIS ModelNB3F8L3010C.ibs (420kB)0Oct, 2015
Package Drawings (1)
Document TitleDocument ID/SizeRevision
QFN32, 5x5, 0.5P, 3.1x3.1EP488AM (57.4kB)A
Order Information
ProductStatusCompliancePackageMSL*ContainerBudgetary Price/Unit
NB3F8L3010CMNGActivePb-free Halide freeQFN-32488AM1Tube74Contact BDTIC
NB3F8L3010CMNR4GActivePb-free Halide freeQFN-32488AM1Tape and Reel1000Contact BDTIC
NB3F8L3010CMNTWGActivePb-free Halide freeQFN-32488AM1Tape and Reel1000Contact BDTIC
Specifications
ProductTypeChannelsInput / Output RatioInput LevelOutput LevelVCC Typ (V)tJitterRMS Typ (ps)tskew(o-o) Max (ps)tpd Typ (ns)tR & tF Max (ps)fmaxClock Typ (MHz)fmaxData Typ (Mbps)
NB3F8L3010CMNGBuffer13:1:10LVCMOS LVTTL LVDS HCSL Crystal SSTL LVPECLLVCMOS3.3 2.50.13 0.14 0.08 0.27 0.18 0.1950500 600100
NB3F8L3010CMNR4GBuffer13:1:10LVPECL LVDS LVCMOS LVTTL HCSL SSTL CrystalLVCMOS3.3 2.50.19 0.13 0.18 0.08 0.14 0.2750500 600100
NB3F8L3010CMNTWG
Fanout Buffer, 3.3V / 2.5V / 1.8V / 1.5V 3:1:10 LVCMOS (108kB) NB3F8L3010C
AC Characteristics of ECL Devices NB100LVEP91
Board Level Application Notes for DFN and QFN Packages NB6L56
Board Mounting Notes for Quad Flat-Pack No-Lead Package (QFN) NB100LVEP91
Clock Generation and Clock and Data Marking and Ordering Information Guide NB100LVEP91
Semiconductor Package Thermal Characterization NGTB15N60EG
Storage and Handling of Drypack Surface Mount Device NB3U23C
Thermal Analysis and Reliability of WIRE BONDED ECL NB100LVEP91
NB3F8L3010C IBIS Model NB3F8L3010C
QFN32, 5x5, 0.5P, 3.1x3.1EP NCN6804