This device is designed for cell phone applications requiring Headset and Speaker Phone, EMI Filtering and ESD Protection. This device offers an intergrated solution in a small package reducing PCB space and cost.
Features
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Applications
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Document Title | Document ID/Size | Revision | Revision Date |
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Design Considerations for ESD/EMI Filters | AND8245/D (245.0kB) | 1 | |
EMI and ESD Filtering of Audio Interconnects | AND8165/D (80kB) | 1 | Dec, 2014 |
Document Title | Document ID/Size | Revision |
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No Conversion Description | 499J (25.6kB) | O |
Document Title | Document ID/Size | Revision | Revision Date |
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Integrated Passive Filter with ESD Protection | NUF2441FC/D (143.0kB) | 5 |
Product | Status | Compliance | Package | MSL* | Container | Budgetary Price/Unit | ||
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NUF2441FCT1G | Active | Pb-free Halide free | Flip-Chip-6 | 499J | 1 | Die Surf Tape and Reel | 3000 | $0.24 |
NUF2441FCT1 | Consult Sales Office | Flip-Chip-6 | 499J | 1 | Die Surf Tape and Reel | 3000 |
Product | Interface | Number of Lines | Filter Type | R Typ (Ω) | C Typ (pF) | IR Max (µA) | V(BR) Typ (V) | VRWM Max (V) |
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NUF2441FCT1G | Audio | 2 | L-C | 0.28 | 250 | 0.1 | 15 | 12 |