HN58X25256FPIAG
| HN58X25256FPIAG.pdf |
Block Diagram |
Dimensions |
| Orderable Part Name | HN58X25256FPIAG#S0 |
|---|---|
| Star Product | - |
| Product Longevity Program (PLP) | |
| Production Status | Mass Production |
| EU RoHS | Compliant |
| RoHS-pdf (China-RoHS) | English |
| Organization(bit) | x 8 |
|---|---|
| Star Product | - |
| Family/ Series | Serial EEPROM |
| Interface | SPI bus |
| Memory Capacity (Kbit) | 256 |
| Package Type | SOP(8) |
| Supply voltage (V) | 1.8 to 5.5 |
| Operating temperature (°C) | -40 to 85 |
| Application | Industrial |
| Production Status | Mass Production |
| Clock frequency (Hz) | 5M/3M |
| Ordering Part Name | HN58X25256FPIAG#S0 |
|---|---|
| Name | SOP |
| JEITA code | P-SOP8-3.9x4.89-1.27 |
| Previous code | FP-8DBV |
| Renesas code | PRSP0008DF-B |
| Terminal count | 8 |
| Terminal pitch (mm) | 1.27 mm |
| Dimensions (mm) | 3.9x4.89 |
| Mass (g) [TYP,] | 0.08 |
| Drawing Link | prsp0008df_b |
| Mount pad | fig0001e |
| Packing | Embossed Tape |
| Terminal material - Base | Cu alloy |
| Terminal material - Surface | Ni/Pd/Au |
| ContainerTape No dry pack | tape-NSP |
|---|---|
| Tape | tape2124 |
| Part Number | Production Status | Product Longevity Program (PLP) | 1000 Piece Budgetary Price | Remarks | Star Produc | RoHS |
|---|---|---|---|---|---|---|
| HN58X25256FPIAG#S0 | Mass Production | Mar, 2030 | | MOQ:2500| WRAP_SPEC:Embossed Tape| OTHER_ENV: | false | RoHS |
