Power Management LSI for Mobile Phone - BD7185AGWL
The BD7185AGWL is an integrated Power Management LSI available in a small 80-pins 0.4mm-pitch 3.8mm-by- 3.8mm Wafer-level CSP package, which is designed to meet demands for space-constrained Smart phones.The device provides 5-Buck Converters.The device also includes 12 general-purpose LDOs providing a wide range of voltage and current capabilities.All Buck Converters and LDOs are fully controllable by the I2C interface. The BD7185AGWL is very easy to use in any mobile platforms.
| Part Number | Status | Package | Unit Quantity | Minimum Package Quantity | Packing Type | RoHS |
|---|
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| BD7185AGWL-E2 | Active | UCSP50L3C | 2500 | 2500 | Taping | Yes |
BD7185AGWL Data Sheet
Specifications| ch | 5 | | Vin1(Min.)[V] | 2.6 | | Vin1(Max.)[V] | 5.5 | | Serial I/F | I2C | | Operating Temperature (Min.)[°C] | -35 | | Operating Temperature (Max.)[°C] | 85 |
| Technical DocumentsPin Configuration |
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