Power Management LSI for Mobile Phone - BD7185AGWL
The BD7185AGWL is an integrated Power Management LSI available in a small 80-pins 0.4mm-pitch 3.8mm-by- 3.8mm Wafer-level CSP package, which is designed to meet demands for space-constrained Smart phones.The device provides 5-Buck Converters.The device also includes 12 general-purpose LDOs providing a wide range of voltage and current capabilities.All Buck Converters and LDOs are fully controllable by the I2C interface. The BD7185AGWL is very easy to use in any mobile platforms.
Part Number | Status | Package | Unit Quantity | Minimum Package Quantity | Packing Type | RoHS |
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BD7185AGWL-E2 | Active | UCSP50L3C | 2500 | 2500 | Taping | Yes |
BD7185AGWL Data Sheet
Specificationsch | 5 | Vin1(Min.)[V] | 2.6 | Vin1(Max.)[V] | 5.5 | Serial I/F | I2C | Operating Temperature (Min.)[°C] | -35 | Operating Temperature (Max.)[°C] | 85 |
| Technical DocumentsPin Configuration![BD7185AGWL](/image/rohm/bd7185agwl.gif) |
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