BALF-CC25-02D3：50Ω / conjugate match to CC2541
STMicroelectronics BAL-CC25-02D3 is an ultra miniature balun which integrates a matching network in a monolithic glass substrate. This has been customized for the CC2541 RF transceivers.
It’s a design using STMicroelectronics IPD (integrated passive device) technology on non-conductive glass substrate to optimize RF performance.
Key Features
- 2.45 GHz balun with integrated matching network
- Matching optimized for following CC2541
- Low insertion loss
- Low amplitude imbalance
- Low phase imbalance
- Coated Flip-Chip on glass
- Small footprint: < 0.88 mm²
- Benefits
- Very low profile
- High RF performance
- PCB space saving versus discrete solution
- BOM count reduction
- Efficient manufacturability
Product Specifications
Application Notes
Technical Notes & Articles
Flyers
Brochures
Sample & Buy
| Part Number | Package | Packing Type | Minimum Sellable Quantity | Unit Price (US$)
* | Quantity | ECCN (EU) | ECCN (US) | Country of Origin |
|---|
| BALF-CC25-02D3 | Chip Scale Package 0.4mm pitch | Tape And Reel | 5000 | 0.113 | 100 | NEC | EAR99 | CHINA |
Quality & Reliability
| Part Number | Package | Grade | RoHS Compliance Grade | Material Declaration** |
|---|
| BALF-CC25-02D3 | Chip Scale Package 0.4mm pitch | Industrial | Ecopack2 | |
