EMIF02-MIC06F3:2-line EMI filter and ESD protection for microphones

The EMIF02-MIC06F3 is a highly integrated device designed to suppress EMI/RFI noise for dual microphone line filtering.

The EMIF02-MIC06F3 Flip-Chip packaging means the package size is equal to the die size. That's why EMIF02-MIC06F3 is a very small device.

Additionally, this filter includes an ESD protection circuitry which prevents damage to the application when subjected to ESD surges up to 15 kV.

Key Features

  • 2-line symmetrical low-pass filter
  • Lead-free package
  • Very low PCB space consuming: < 1.5 mm2
  • Very thin package: 0.65 mm
  • High efficiency in ESD suppression IEC 61000-4-2 level 4
  • High reliability offered by monolithic integration
  • High reduction of parasitic elements through integration and wafer level packaging
  • Complies with the following standards
    • IEC 61000-4-2 level 4:
      • 15 kV (air discharge)
      • 8 kV (contact discharge)
    • 8 kV (contact discharge)
Product Specifications
DescriptionVersionSize
DS5981: 2-line IPAD™ EMI filter and ESD protection5.01 MB
Application Notes
DescriptionVersionSize
AN2348: IPAD™ 400 µm Flip Chip: package description and recommendations for use5.0261 KB
AN1235: IPAD™ 500 µm Flip Chip: package description and recommendations for use8.0251 KB
Technical Notes & Articles
DescriptionVersionSize
TN1200: Micro-bump Flip Chip: package description and recommendations for use1.0280 KB
TN1173: Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches4.0330 KB
Flyers
DescriptionVersionSize
Enhanced ESD protection and EMI filters for audio/video interfaces1.0823 KB
The ultimate HDMI control-link buffer2.1478 KB
Sample & Buy
Part NumberPackagePacking TypeUnit Price (US$) *QuantityECCN (EU)ECCN (US)Country of Origin
EMIF02-MIC06F3Chip Scale Package 0.4mm pitchTape And Reel0.4061000NECEAR99CHINA
Quality & Reliability
Part NumberPackageGradeRoHS Compliance GradeMaterial Declaration**
EMIF02-MIC06F3Chip Scale Package 0.4mm pitchIndustrialEcopack2md_m0-wspc-csps0.4-wspc-7-10_k9m0-wspc-emi2h3g-wspc-lock.pdf
md_m0-wspc-csps0.4-wspc-7-10_k9m0-wspc-emi2h3g.xml
2-line IPAD™ EMI filter and ESD protection EMIF02-MIC06F3
IPAD™ 400 µm Flip Chip: package description and recommendations for use HSP061-4M10
IPAD™ 500 µm Flip Chip: package description and recommendations for use CPL-WBF-00D3
Micro-bump Flip Chip: package description and recommendations for use ESDAXLC6-1BU2
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches FLC21
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches EMIF02-MIC06F3
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches EMIF02-MIC06F3
md_m0-wspc-csps0.4-wspc-7-10_k9m0-wspc-emi2h3g-wspc-lock.pdf EMIF02-MIC06F3
md_m0-wspc-csps0.4-wspc-7-10_k9m0-wspc-emi2h3g.xml EMIF02-MIC06F3