EMIF03-SIM02F2:3-line EMI filter and ESD protection for SIM card interfaces

The EMIF03-SIM02F2 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference.The EMIF03 Flip Chip packaging means the package size is equal to the die size.

This filter includes an ESD protection circuitry which prevents damage to the application when subjected to ESD surges up 15kV.

Key Features

  • High reliability offered by monolithic integration
  • High efficiency in ESD suppression
  • EMI symmetrical (I/O) low-pass filter
  • Lead-free package
  • High efficiency in EMI filtering
  • Very thin package: 0.65 mm
  • High reduction of parasitic elements through integration and wafer level packaging
  • Very low PCB space consuming: 1.42 mm x 1.42 mm
Product Specifications
DescriptionVersionSize
DS4081: 3-line IPAD™, EMI filter including ESD protection6.1147 KB
Application Notes
DescriptionVersionSize
AN4541: EMI filters for SD3.0 card high-speed SD card protection and filtering devices1.11 MB
AN2348: IPAD™ 400 µm Flip Chip: package description and recommendations for use5.0261 KB
AN1235: IPAD™ 500 µm Flip Chip: package description and recommendations for use8.0251 KB
Technical Notes & Articles
DescriptionVersionSize
TN1173: Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches4.0330 KB
Flyers
DescriptionVersionSize
Single chip IPADTM memory card transceiver1.0567 KB
Sample & Buy
Part NumberPackagePacking TypeUnit Price (US$) *QuantityECCN (EU)ECCN (US)Country of Origin
EMIF03-SIM02F2Chip Scale Package 0.5mm pitchTape And Reel0.2721000NECEAR99-
Quality & Reliability
Part NumberPackageGradeRoHS Compliance GradeMaterial Declaration**
EMIF03-SIM02F2Chip Scale Package 0.5mm pitchIndustrialEcopack2md_qb-wspc-csps0.5-wspc-7-10_kdqb-wspc-emi3t2q_vers2_sdm_signed.pdf
md_qb-wspc-csps0.5-wspc-7-10_kdqb-wspc-emi3t2q_vers2.xml
3-line IPAD™, EMI filter including ESD protection EMIF03-SIM02F2
EMI filters for SD3.0 card high-speed SD card protection and filtering devices EMIF03-SIM05F3
IPAD™ 400 µm Flip Chip: package description and recommendations for use HSP061-4M10
IPAD™ 500 µm Flip Chip: package description and recommendations for use CPL-WBF-00D3
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches FLC21
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches EMIF03-SIM02F3
md_qb-wspc-csps0.5-wspc-7-10_kdqb-wspc-emi3t2q_vers2_sdm_signed.pdf EMIF03-SIM02F2
md_qb-wspc-csps0.5-wspc-7-10_kdqb-wspc-emi3t2q_vers2.xml EMIF03-SIM02F2