EMIF06-1002F2:6-line EMI filter and ESD protection

The EMIF06-1002F2 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The EMIF06-1002F2 Flip Chip packaging means the package size is equal to the die size.

This filter includes an ESD protection circuitry which prevents damage to the application when subjected to ESD surges up 15 kV. This device includes 6 EMI filters.

Key Features

  • Complies with the following standardsIEC 61000-4-2 level 4:15 kV (air discharge)8 kV (contact discharge)
  • High reduction of parasitic elements through integration and wafer level packaging
  • Lead-free package
  • Very thin package: 0.65 mm
  • Very low PCB space consumption 1.92 mm x 1.79 mm
  • High reliability offered by monolithic integration
  • High efficiency in ESD suppression (IEC 61000-4-2 level 4 on external pins)
Product Specifications
DescriptionVersionSize
DS5837: 6-line IPAD™, EMI filter and ESD protection2.1210 KB
Application Notes
DescriptionVersionSize
AN2348: IPAD™ 400 µm Flip Chip: package description and recommendations for use5.0261 KB
AN1235: IPAD™ 500 µm Flip Chip: package description and recommendations for use8.0251 KB
Technical Notes & Articles
DescriptionVersionSize
TN1173: Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches4.0330 KB
Sample & Buy
Part NumberPackagePacking TypeUnit Price (US$) *QuantityECCN (EU)ECCN (US)Country of Origin
EMIF06-1002F2Chip Scale Package 0.5mm pitchTape And Reel0.301100NECEAR99CHINA
Quality & Reliability
Part NumberPackageGradeRoHS Compliance GradeMaterial Declaration**
EMIF06-1002F2Chip Scale Package 0.5mm pitchIndustrialEcopack2
6-line IPAD™, EMI filter and ESD protection EMIF06-1002F2
IPAD™ 400 µm Flip Chip: package description and recommendations for use HSP061-4M10
IPAD™ 500 µm Flip Chip: package description and recommendations for use CPL-WBF-00D3
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches FLC21