The EMIF08-VID01F2 is an 8 line highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The flip chip packaging means the package size is equal to the die size.
This filter includes ESD protection circuitry, which prevents damage to the application when it is subjected to ESD surges up to 15kV.
Key Features
| Description | Version | Size |
|---|---|---|
| DS4376: 8 line low capacitance EMI filter and ESD protection | 2.2 | 486 KB |
| Description | Version | Size |
|---|---|---|
| AN2348: IPAD™ 400 µm Flip Chip: package description and recommendations for use | 5.0 | 261 KB |
| AN1235: IPAD™ 500 µm Flip Chip: package description and recommendations for use | 8.0 | 251 KB |
| Part Number | Package | Packing Type | Unit Price (US$) * | Quantity | ECCN (EU) | ECCN (US) | Country of Origin |
|---|---|---|---|---|---|---|---|
| EMIF08-VID01F2 | Chip Scale Package 0.5mm pitch | Tape And Reel | 0.487 | 1000 | NEC | EAR99 | CHINA |
| Part Number | Package | Grade | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|
| EMIF08-VID01F2 | Chip Scale Package 0.5mm pitch | Industrial | Ecopack2 | md_qd-wspc-csps0.5-wspc-17-20_k9qd-wspc-emi8t2e_vers2_sdm_signed.pdf md_qd-wspc-csps0.5-wspc-17-20_k9qd-wspc-emi8t2e_vers2.xml |
