EMIF10-LCD02F3:10-line EMI filter and ESD protection for display interfaces

The EMIF10-LCD02F3 is a 10-line highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The EMIF10 Flip-Chip packaging means the package size is equal to the die size.

This filter includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up 15 kV.

Key Features

  • High reduction of parasitic elements through integration and wafer level packaging
  • High reliability offered by monolithic integration
  • Complies with the following standards
  • MIL STD 883G - Method 3015-6 Class 3
  • Very thin package: 0.60 mm
  • Very low PCB space occupation: < 4 mm2
  • Lead-free package
  • High efficiency in EMI filtering
  • EMI symmetrical (I/O) low-pass filter
  • Compatible with high speed data rate
  • High efficiency in ESD suppression
  • 400 μm pitch
Product Specifications
DescriptionVersionSize
DS4363: 10-line IPAD™, EMI filter and ESD protection for LCD and cameras3.1156 KB
Application Notes
DescriptionVersionSize
AN2348: IPAD™ 400 µm Flip Chip: package description and recommendations for use5.0261 KB
AN1235: IPAD™ 500 µm Flip Chip: package description and recommendations for use8.0251 KB
AN3141: LC filters for mobile phone LCD and camera links1.1338 KB
Technical Notes & Articles
DescriptionVersionSize
TA0318: EMI and ESD consideration for LCD and cameras in wireless handsets1.2115 KB
TN1173: Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches4.0330 KB
HW Model & CAD Libraries
DescriptionVersionSize
EMIF10-LCD02F3 S-parameter model (.sxp)658 KB
Sample & Buy
Part NumberPackagePacking TypeUnit Price (US$) *QuantityECCN (EU)ECCN (US)Country of Origin
EMIF10-LCD02F3Chip Scale Package 0.4mm pitchTape And Reel0.57350NECEAR99CHINA
Quality & Reliability
Part NumberPackageGradeRoHS Compliance GradeMaterial Declaration**
EMIF10-LCD02F3Chip Scale Package 0.4mm pitchIndustrialEcopack2md_0z-wspc-csps0.4-wspc-21-25_k90z-wspc-emi10lv.pdf
md_0z-wspc-csps0.xml
10-line IPAD™, EMI filter and ESD protection for LCD and cameras EMIF10-LCD02F3
IPAD™ 400 µm Flip Chip: package description and recommendations for use HSP061-4M10
IPAD™ 500 µm Flip Chip: package description and recommendations for use CPL-WBF-00D3
LC filters for mobile phone LCD and camera links EMIF08-LCD04M16
EMI and ESD consideration for LCD and cameras in wireless handsets EMIF08-1005M16
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches FLC21
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches EMIF10-LCD02F3
md_0z-wspc-csps0.4-wspc-21-25_k90z-wspc-emi10lv.pdf EMIF10-LCD02F3
md_0z-wspc-csps0.xml EMIF10-LCD02F3