LSM303AH:Ultra-compact high-performance e-compass 3D accelerometer and 3D magnetometer module

The LSM303AH is an ultra-low-power high-performance system-in-package featuring a 3D digital linear acceleration sensor and a 3D digital magnetic sensor.

The LSM303AH has user-selectable linear acceleration full scales of ±2g/±4g/±8g/±16 g and is capable of measuring accelerations with output data rates from 1 Hz to 6400 Hz. The device has a magnetic field dynamic range of ±50 gauss with output data rates from10 Hz to 100 Hz. The LSM303AH includes an I2C serial bus interface that supports standard, fast mode, fast mode plus, and high-speed (100 kHz, 400 kHz, 1 MHz, and 3.4 MHz) and an SPI serial standard interface.

The LSM303AH has an integrated 256-level first-in, first-out (FIFO) buffer allowing the user to store data in order to limit intervention by the host processor. The FIFO buffer applies only to the accelerometer.

The embedded self-test capability allows the user to check the functioning of the sensor in the final application.

The system can be configured to generate an interrupt signal for free-fall, motion detection and magnetic field detection. The magnetic and accelerometer blocks can be enabled or put into power-down mode separately.

The LSM303AH is available in a plastic land grid array package (LGA) and is guaranteed to operate over an extended temperature range from -40 °C to +85 °C.

Key Features

  • 3 magnetic field channels and 3 acceleration channels
  • ±50 gauss magnetic dynamic range
  • ±2/±4/±8/±16 g selectable acceleration full scales
  • Anti-aliasing filter
  • 16-bit data output
  • SPI / I2 C serial interfaces
  • Analog supply voltage 1.71 V to 1.98 V
  • Programmable interrupt generators for free-fall, motion and magnetic field detection
  • Embedded self-test
  • Embedded 256-level FIFO
  • Embedded temperature sensor
  • Embedded digital functions: step detector, step counter, significant motion and tilt
  • ECOPACK® , RoHS and “Green” compliant
Product Specifications
DescriptionVersionSize
DS11000: Ultra-compact high-performance eCompass module: ultra-low-power 3D accelerometer and 3D magnetometer6.01 MB
Technical Notes & Articles
DescriptionVersionSize
TN0018: Surface mounting guidelines for MEMS sensors in an LGA package5.0218 KB
Design Notes & Tips
DescriptionVersionSize
DT0058: Computing tilt measurement and tilt-compensated e-compass1.0220 KB
DT0059: Ellipsoid or sphere fitting for sensor calibration2.0409 KB
DT0060: Exploiting the gyroscope to update tilt measure and e-compass1.0226 KB
Brochures
DescriptionVersionSize
MEMS and Sensors, Smart solutions for IoT and enhanced user experience1 MB
Sample & Buy
Part NumberPackagePacking TypeUnit Price (US$) *QuantityECCN (EU)ECCN (US)Country of Origin
LSM303AHLGA 2X2X1 12LD PITCH 0.5MMTray-1000NECEAR99-
LSM303AHTRLGA 2X2X1 12LD PITCH 0.5MMTape And Reel1.6351000NECEAR99-
Quality & Reliability
Part NumberPackageGradeRoHS Compliance GradeMaterial Declaration**
LSM303AHLGA 2X2X1 12LD PITCH 0.5MMIndustrialEcopack2
LSM303AHTRLGA 2X2X1 12LD PITCH 0.5MMIndustrialEcopack2
Ultra-compact high-performance eCompass module: ultra-low-power 3D accelerometer and 3D magnetometer LSM303AH
Surface mounting guidelines for MEMS sensors in an LGA package L3G3200D
Computing tilt measurement and tilt-compensated e-compass LSM303DLHC
Ellipsoid or sphere fitting for sensor calibration LSM303DLHC
Exploiting the gyroscope to update tilt measure and e-compass LSM303DLHC
Surface mounting guidelines for MEMS sensors in an LGA package L3G3200D