The MP34DT04-C1 is an ultra-compact, low-power, omnidirectional, digital MEMS microphone built with a capacitive sensing element and an IC interface.
The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process dedicated to produce audio sensors.
The MP34DT04-C1 IC interface is manufactured using a CMOS process that allows designing a dedicated circuit able to provide a digital signal externally in PDM format.
The has an acoustic overload point of 120 dBSPL with a 64 dB signal-to-noise ratio and –26 dBFS sensitivity.
The MP34DT04-C1 is available in a top-port, SMD-compliant, EMI-shielded package and is guaranteed to operate over an extended temperature range from -40 °C to +85 °C.
Key Features
Description | Version | Size |
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DS11865: MEMS audio sensor omnidirectional digital microphone | 2.0 | 628 KB |
Description | Version | Size |
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AN4428: Best practices in the manufacturing process of MEMS microphones | 1.1 | 1 MB |
AN4427: Gasket design for optimal acoustic performance in MEMS microphones | 2.0 | 840 KB |
AN4426: Tutorial for MEMS microphones | 1.1 | 1009 KB |
Description | Version | Size |
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Health and Wellness Mobility Cloud computing | 1 MB |
Description | Version | Size |
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APWorkbench software for audio ICs and MEMS microphones | 1.0 | 2 MB |
MEMS analog and digital microphones | 989 KB |
Part Number | Package | Packing Type | Unit Price (US$) * | Quantity | ECCN (EU) | ECCN (US) | Country of Origin |
---|---|---|---|---|---|---|---|
MP34DT04TR-C1 | HLGA4 4x3x1 | Tape And Reel | - | - | NEC | EAR99 | - |
Part Number | Package | Grade | RoHS Compliance Grade | Material Declaration** |
---|---|---|---|---|
MP34DT04TR-C1 | HLGA4 4x3x1 | Industrial | Ecopack3 | md_0e-wspc-hlga-wspc-4x3x1-wspc-4ld_b50e-wspc-mv8uaaa_vers2_signed.pdf md_0e-wspc-hlga-wspc-4x3x1-wspc-4ld_b50e-wspc-mv8uaaa_vers2.xml |