EMIF03-SIM02C2：3-line EMI filter and ESD protection for SIM card interfaces
The EMIF03-SIM02C2 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The EMIF03 Flip-Chip packaging means the package size is equal to the die size.
This filter includes an ESD protection circuitry which protects the application from damage when subjected to ESD surges up 15 kV.
技术特点Key Features- EMI symmetrical (I/O) low-pass filter
- high efficiency in EMI filtering
- lead-free coated package
- very low PCB space occupation:
- 1.42 mm x 1.42 mm
- very thin package: 0.65 mm
- high efficiency in ESD suppression
- high reliability offered by monolithic integration
- high reduction of parasitic elements through integration and wafer level packaging
- Complies with following standards:
- IEC 61000-4-2 level 4 on external and VCCpins:15 kV (air discharge)8 kV (contact discharge)
- MIL STD 883G - Method 3015-7 Class 3
| 产品状态Product StatusNRND 数据手册DataSheetEMIF03-SIM02C2：数据手册DataSheet 下载 |
Product Specifications
Flyer
订购型号Ordering Part Nummber
| 产品型号 | Marketing Status | Package | Packing Type | Unit Price (US$)*@ 1000 | RoHS Compliance Grade |
|---|
| EMIF03-SIM02C2 | NRND | Chip Scale Package 0.5mm pitch | Tape And Reel | .286 | Ecopack2 |
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