TH58BVG3S0HBAI6 BENAND (Built-in ECC SLCNAND)

DataSheet
Feature
Capacity (bit)8G(4G×2)
Tech. node (nm)24
Page size (bit)(4096+128)×8
Block size (bit)(256K+8K)×8
I/O (bit)8
Keyword8Gbit BENAND, 3.3V, x8, 24nm, FBGA
RoHS Compatible Product(s) (#)Available
Package Information
Toshiba Package NameFBGA
Pins67
Package size6.5mm x 8mm
Pin pitch0.8
Electrical Characteristics
CharacteristicsSymbolConditionValueUnit
Access Time (1st access) (Max)--220μs
Access Time (Serial Cycle) (Min)--25nsec
Operational TemperatureTopr--40 to 85degC
Supply VoltageVCC-2.7 to 3.6V
Block Erasing Time (Typ.)tBERASE-2.5msec
Program Time (Typ.)tPROG-0.34μs
Documents
Environment InformationCertificate Regarding EU RoHS(2011/65/EU)Controlled Substances[Apr,2016](PDF: 52KB)
Environment InformationCertificate on Content of SVHC of REACH[Apr,2016](PDF: 43KB)