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SQD50P04-13L Automotive P-Channel 40 V (D-S) 175 °C MOSFET

Features

• TrenchFET® power MOSFET
• Package with low thermal resistance
• 100 % Rg and UIS tested

Datasheet

• SQD50P04-13L

Markings

• Part Marking Information - TO-252 (DPAK), TO251

Ordering Info

• Ordering Information - DPAK / TO-252 and Reverse DPAK

Package Drawings

• Package Information - TO-252AA Case Outline

Pad Guidelines

• Application Note 826 - RECOMMENDED MINIMUM PADS FOR DPAK (TO-252)

RC Thermal Models

• SiR696DP_RC - R-C Thermal Model Parameters
• SQD50P04-13L_RC - R-C Thermal Model Parameters

Reel Info

• Reel Information - Reel

Reliability Data

• Package Reliability - Environmental and Package Testing Data for DPAK (TO-252)
• Silicon Technology Reliability - P-Channel - Automotive Accelerated Operating Life Test Result

Tape Info

• 90-2339-1 - Tape Drawing for TO-252 (DPAK) (T1 Method)
• 90-2369-x - Tape Drawing for TO-252 (DPAK) (T4 Method)
• PACK-0020- - Device Orientation for TO-252 and Reverse TO-252 (T4)
• PACK-0020- - Device Orientation for TO-252, Reverse TO-252 and TO-251 Short Lead (T1)

SPICE Models (*.pdf)

• SQD50P04-13L-DS - DS-SPICE Model for SQD50P04-13L
• SQM110P06-8m9L-DS - DS-SPICE Model for SQM110P06-8m9L

SPICE Models (*.zip)

• SQD50P04-13L-zip - SPICE Models for SQD50P04-13L
• SQM110P06-8m9L-zip - SPICE Models for SQM110P06-8m9L