技术特性

• Package type: surface mount
• Package form: GW, RGW
• Dimensions (L x W x H in mm): 2.3 x 2.3 x 2.55

数据手册DataSheet 下载

• VEMD2003X01, VEMD2023X01

Constructions

• Component Construction - Component Construction

Glossary

• Symbols and Terminology - Symbols and Terminology
• Type Designation Code - Type Designation Code

Packaging Information

• Packaging and Order Information - Packaging and Order Information

Product Literature

• Selector Guide - IR Emitters, Photo Detectors, and Optical Sensors
• Tradeshow Brochure - Infrared Emitters and Photo Detectors

Quality Info

• Assembly Instructions - Assembly Instructions
• Reliability and Statistics Glossary - Reliability and Statistics Glossary

Reference Data

• Physics and Technology - Physics and Technology

Technical Papers

• Measurement Techniques - Measurement Techniques

VEMD2003X01, VEMD2023X01 84147

Component Construction 81579

Symbols IRDC 81288

Type Designation Code 81579

Packaging Information 30205

Selector Guide 81579

Tradeshow Brochure 84163

Ordering Information 33008

Reliability and Statistics Glossary 81579

Physics and Technology 81579

Measurement Techniques 81579

VEMD2003X01, VEMD2023X01 Silicon PIN Photodiode 84147