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SiHB33N60E E Series Power MOSFET

Features

• Low figure-of-merit (FOM): Ron x Qg
• Low input capacitance (Ciss)
• Reduced switching and conduction losses

Datasheet

• SiHB33N60E

General Information

• General Information - Useful Web Links

Package Drawings

• Package Information - TO-263AB (High Voltage)

Pad Guidelines

• PAD Pattern - D2PAK

Product Literature

• Product Sheet - 500 V, 600 V, and 650 V High-Performance Superjunction MOSFETs

RC Thermal Models

• SiHB33N60E_RC - R-C Thermal Model Parameters

Reliability Data

• Package Reliability - Environmental and Package Testing Data for D2PAK (TO-263) (HVM)
• Silicon Technology Reliability - N-Channel Accelerated Operating Life Test Result

Tape Info

• Device Orientation - Device Orientation for TO-252 and TO-263 (T5)
• PACK-0020- - Device Orientation for TO-263 (T1)

SPICE Models (*.pdf)

• SiHB33N60E-DS - DS-SPICE Model for SiHB33N60E

SPICE Models (*.zip)

• SiHB33N60E-zip - SPICE Models for SiHB33N60E