74AHC(T)373: 八进制D型透明锁存器;3态

74AHC373;74AHCT373是高速硅栅CMOS器件,与低功耗肖特基TTL (LSTTL)针脚兼容。该类器件的规格符合JEDEC标准No. 7-A。

74AHC373;74AHCT373由八个D型透明锁存器组成,具有适用于每个锁存器的单独D型输入和适合总线应用的3态真正输出。锁存使能输入(LE)和输出使能输入(OE)为所有锁存器共用。

针脚LE为高电平时,Dn输入处的数据会输入锁存器。在这种情况下,锁存器是穿透的,即每当与锁存输出对应的Dn输入发生变化时,锁存输出就会随之发生改变。针脚LE为低电平时,锁存器存储LE从高电平跃迁至低电平前的一个设置时间在Dn输入处出现的信息。

针脚OE为低电平时,8个锁存器的内容可在输出处获取。针脚OE为高电平时,输出转为高阻抗关断状态。OE输入的操作不会影响锁存器的状态。

74AHC373;74AHCT373在功能上等同于74AHC573;74AHCT573,但针脚排列不同。

74AHC_T_373: 产品结构框图
Outline 3d SOT360-1
数据手册 (1)
名称/描述Modified Date
Octal D-type transparent latch; 3-state (REV 1.0) PDF (100.0 kB) 74AHC_AHCT373 [English]20 May 2008
应用说明 (6)
名称/描述Modified Date
Sorting through the low voltage logic maze (REV 1.0) PDF (72.0 kB) AN10156 [English]13 Mar 2013
Package lead inductance considerations in high-speed applications (REV 1.0) PDF (43.0 kB) AN212 [English]13 Mar 2013
A metastability primer (REV 1.0) PDF (40.0 kB) AN219 [English]13 Mar 2013
Ground and VCC Bounce of High-Speed Integrated Circuits (REV 1.0) PDF (25.0 kB) AN223 [English]13 Mar 2013
Live Insertion Aspects of Philips Logic Families (REV 1.0) PDF (73.0 kB) AN252 [English]13 Mar 2013
Pin FMEA for AHC/AHCT family (REV 1.0) PDF (52.0 kB) AN11106 [English]04 Nov 2011
手册 (2)
名称/描述Modified Date
電圧レベルシフタ (REV 1.1) PDF (3.1 MB) 75017511_JP [English]16 Feb 2015
Voltage translation: How to manage mixed-voltage designs with NXP® level translators (REV 1.0) PDF (2.6 MB) 75017511 [English]20 May 2014
封装信息 (2)
名称/描述Modified Date
plastic small outline package; 20 leads; body width 7.5 mm (REV 1.0) PDF (335.0 kB) SOT163-1 [English]08 Feb 2016
plastic thin shrink small outline package; 20 leads; body width 4.4 mm (REV 1.0) PDF (304.0 kB) SOT360-1 [English]08 Feb 2016
包装 (2)
名称/描述Modified Date
SO20; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering... (REV 2.0) PDF (246.0 kB) SOT163-1_118 [English]15 Apr 2013
TSSOP20; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or... (REV 4.0) PDF (225.0 kB) SOT360-1_118 [English]15 Apr 2013
支持信息 (3)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]30 Sep 2013
Footprint for wave soldering (REV 1.0) PDF (16.0 kB) SSOP-TSSOP-VSO-WAVE [English]08 Oct 2009
IBIS
订购信息
型号状态
74AHC373DActive
74AHC373PWActive
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
74AHC373PWSOT360-1SSOP-TSSOP-VSO-WAVEReel 13" Q1/T1Active74AHC373PW,118 (9352 626 52118)AHC37374AHC373PWweek 5, 200584.96.621.51E811
Bulk PackActive74AHC373PW,112 (9352 626 52112)AHC37374AHC373PWweek 5, 200584.96.621.51E811
74AHC373DSOT163-1Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 13" Q1/T1Active74AHC373D,118 (9352 626 51118)74AHC373D74AHC373Dweek 30, 200484.96.621.51E811
Bulk PackActive74AHC373D,112 (9352 626 51112)74AHC373D74AHC373Dweek 30, 200484.96.621.51E811
Octal D-type transparent latch; 3-state 74AHC373PW
Sorting through the low voltage logic maze 74LVC_H_245A_Q100
Package lead inductance considerations in high-speed applications 74LVC_H_245A_Q100
A metastability primer 74AHC573PW
Ground and VCC Bounce of High-Speed Integrated Circuits 74ALVC164245DGG-Q100
Live Insertion Aspects of Philips Logic Families 74HC_T_245_Q100
Pin FMEA for AHC/AHCT family 74AHC_T_245_Q100
電圧レベルシフタ 74AVC16245DGG-Q100
Voltage translation: How to manage mixed-voltage designs with NXP® level translators 74AVC16245DGG-Q100
ahc373 IBIS model 74AHC373PW
SOT360-1 LPC1112FDH20
SSOP-TSSOP-VSO-WAVE LPC1114FDH28
Reel 13" Q1/T1 LPC824M201JDH20
SOT163-1 LPC1112FD20
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Reel 13" Q1/T1 LPC812M101JD20
74HC_T_373
PCA9634
SA615