| 档案名称 |
标题 |
类型 |
格式 |
| 74HC14D |
Hex inverting Schmitt trigger |
Data sheet |
pdf |
| AN11044 |
Pin FMEA 74HC/74HCT family |
Application note |
pdf |
| AN2021 |
Thermal considerations for FAST logic products |
Application note |
pdf |
| AN11051 |
Pin FMEA HEF4000 family |
Application note |
pdf |
| AN11009 |
Pin FMEA for LVC family |
Application note |
pdf |
| AN10161 |
PicoGate Logic footprints |
Application note |
pdf |
| AN11052 |
Pin FMEA for AUP family
|
Application note |
pdf |
| AN10156 |
Sorting through the low voltage logic maze
|
Application note |
pdf |
| AN243 |
LVT (Low Voltage Technology) and ALVT (Advanced LVT) |
Application note |
pdf |
| AN246 |
Transmission Lines and Terminations with Philips Advanced Logic Families |
Application note |
pdf |
| AN240 |
Interfacing 3 Volt and 5 Volt Applications |
Application note |
pdf |
| AN263 |
Power considerations when using CMOS and BiCMOS logic devices
|
Application note |
pdf |
| AN223 |
Ground and VCC Bounce of High-Speed Integrated Circuits |
Application note |
pdf |
| AN202 |
Testing and specifying FAST logic |
Application note |
pdf |
| AN223 |
Ground and VCC Bounce of High-Speed Integrated Circuits |
Application note |
pdf |
| AN203 |
Test Fixtures for High Speed Logic |
Application note |
pdf |
| AN212 |
Package lead inductance considerations in high-speed applications |
Application note |
pdf |
| HCT_USER_GUIDE |
HC/T User Guide |
User manual |
pdf |
| SSOP-TSSOP-VSO-REFLOW |
Footprint for reflow soldering |
Reflow soldering |
pdf |
| SSOP-TSSOP-VSO-WAVE |
Footprint for wave soldering |
Wave soldering |
pdf |
| SO-SOJ-WAVE |
Footprint for wave soldering |
Wave soldering |
pdf |
| SO-SOJ-REFLOW |
Footprint for reflow soldering |
Reflow soldering |
pdf |
| hc |
lv Spice model |
SPICE model |
zip |
| sot027-1_po |
plastic dual in-line package; 14 leads (300 mil)
|
Outline drawing |
pdf |
| sot108-1_po |
plastic small outline package; 14 leads; body width 3.9 mm
|
Outline drawing |
pdf |
| SOT108-1_118 |
SO14; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code (12NC) ending 118
|
Packing |
pdf |
| SOT402-1_653 |
TSSOP14; Reel pack; SMD, 13"; Q1 Standard product orientation; Orderable part number ending, 653 or HL; Ordering code (12NC) ending 653
|
Packing |
pdf |
| SOT402-1_623 |
TSSOP14; Reel pack; SMD, 13"; Q1 Standard product orientation; Orderable part number ending, 623 or XP; Ordering code (12NC) ending 623
|
Packing |
pdf |
| SOT402-1_118 |
TSSOP14; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code (12NC) ending 118
|
Packing |
pdf |
| sot402-1_po |
plastic thin shrink small outline package; 14 leads; body width 4.4 mm
|
Outline drawing |
pdf |
| sot402-1_fr |
Footprint for reflow soldering SOT402-1
|
Reflow soldering |
pdf |
| sot762-1_fr |
Footprint for reflow soldering SOT762-1
|
Reflow soldering |
pdf |
| SOT762-1_115 |
Standard product orientation 12NC ending 115
|
Packing |
pdf |
| sot762-1_po |
plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; body 2.5 x 3 x 0.85 mm
|
Outline drawing |
pdf |
| SOT337-1_118 |
Standard product orientation 12NC ending 118
|
Packing |
pdf |
| sot337-1_po |
plastic shrink small outline package; 14 leads; body width 5.3 mm
|
Outline drawing |
pdf |
