74LVCH322244AEC：32位缓冲器/线路驱动器；具有30 Ω串联端接电阻；5 V容压输入/输出；3态

74LVCH322244A是带3态输出的32位非反相缓冲器/线路驱动器。3态输出通过输出使能输入nOE控制。输入nOE上的高电平使输出呈高阻抗关断状态。

该器件设计为在高电平和低电平输出级中都具有30 Ω的串联端接电阻，以减少线路噪声。

为确保上电或掉电期间的高阻抗状态，nOE应当通过上拉电阻连接到VCC；最低电阻值由驱动器灌入电流的能力确定。

输入可通过3.3 V或5 V器件进行驱动。在3态操作中，输出能处理5 V的电压。这些特性允许在混合3.3 V和5 V环境中使用这些器件。

数据输入上的总线保持无需使用外部上拉电阻来将未使用的输入或浮动数据输入保持在有效的逻辑电平。

特性和优势
    • 5 V容压输入/输出，可实现与5 V逻辑的接合
    • 1.2 V至3.6 V的宽电源电压范围
    • CMOS低功耗
    • MULTIBYTE直通式标准针脚排列架构
    • 多个低电感电源和接地针脚，可实现最低噪声和地弹
    • 具有TTL电平的直接接口
    • 集成式30 Ω端接电阻
    • 所有数据输入都具有总线保持
    • 符合JEDEC标准：
      • JESD8-7A（1.65 V至1.95 V）
      • JESD8-5A（2.3 V至2.7 V）
      • JESD8-C/JESD36（2.7 V至3.6 V）
    • JESD8-7A（1.65 V至1.95 V）
    • JESD8-5A（2.3 V至2.7 V）
    • JESD8-C/JESD36（2.7 V至3.6 V）
    • ESD保护：
      • HBM JESD22-A114F超过2000 V
      • MM JESD22-A115-B超过200 V
      • CDM JESD22-C101E超过1000 V
    • HBM JESD22-A114F超过2000 V
    • MM JESD22-A115-B超过200 V
    • CDM JESD22-C101E超过1000 V
    • 额定温度范围为-40 °C至+85 °C和-40 °C至+125 °C
    • 采用塑封精细间距球栅阵列封装
产品图片
功能框图
Block diagram: 74LVCH322244AEC, 74LVCH32244AEC
关键参数
型号Product statusVCC (V)Logic switching levelsOutput drive capability (mA)fmax (MHz)No of bitsPower dissipation considerationsTamb (Cel)Rth(j-a) (K/W)Ψth(j-top) (K/W)Package name
74LVCH322244AECProduction1.2 - 3.6CMOS/LVTTL+/- 1217532low-40~1256016.0LFBGA96
封装与包装
型号封装Outline versionReflow-/Wave soldering包装产品状态标示可订购的器件编号, (订购码 (12NC))
74LVCH322244AEC
LFBGA96
(SOT536-1)		sot536-1_posot536-1_frReel 13" Q1/T1 in Drypack量产H322244A74LVCH322244AEC,51( 9352 639 30518 )
Tray, Bakeable, Multiple in Drypack量产H322244A74LVCH322244AEC;55( 9352 639 30557 )
Tray, Bakeable, Single in Drypack量产H322244A74LVCH322244AEC:55( 9352 639 30551 )
74LVCH322244AEC/G
LFBGA96
(SOT536-1)		sot536-1_posot536-1_frReel 13" Q1/T1 in Drypack量产H322244A74LVCH322244AEC/G,( 9352 811 38518 )
Tray, Bakeable, Multiple in Drypack量产H322244A74LVCH322244AEC/G;( 9352 811 38557 )
Tray, Bakeable, Single in Drypack量产H322244A74LVCH322244AEC/G:( 9352 811 38551 )
无铅环保信息
型号可订购的器件编号RoHS / RHF无铅转换日期EFRIFR (FIT)MTBF（小时）潮湿敏感度等级MSL LF
74LVCH322244AEC74LVCH322244AEC,51123.83.872.58E834
74LVCH322244AEC74LVCH322244AEC;55123.83.872.58E834
74LVCH322244AEC74LVCH322244AEC:55123.83.872.58E834
74LVCH322244AEC/G74LVCH322244AEC/G,Always Pb-free123.83.872.58E8NA2
74LVCH322244AEC/G74LVCH322244AEC/G;Always Pb-free123.83.872.58E8NA2
74LVCH322244AEC/G74LVCH322244AEC/G:Always Pb-free123.83.872.58E8NA2
文档资料
档案名称标题类型格式日期
74LVCH322244A (中文)32-bit buffer/line driver; 30 Ohm series termination resistors; 5 V tolerant input/output; 3-stateData sheetpdf2011-12-16
AN240Interfacing 3 Volt and 5 Volt ApplicationsApplication notepdf1995-09-15
AN263Power considerations when using CMOS and BiCMOS logic devicesApplication notepdf2002-02-05
AN11009Pin FMEA for LVC familyApplication notepdf2011-02-04
AN1026(LF)BGA Application note, ATO InnovationApplication notepdf2013-03-13
ANLFBGAANLFBGA 32-Bit Logic Families in Low-profile Fine-pitch Ball Grid Array (LFBGA) PackagesApplication notepdf2013-03-13
AN212Package lead inductance considerations in high-speed applicationsApplication notepdf2013-03-13
AN10156Sorting through the low voltage logic mazeApplication notepdf2013-03-13
75017668Low voltage CMOS family - LVCBrochurepdf2015-07-10
lvch322244alvch322244a IBIS modelIBIS modelibs2013-04-07
75017285Logic selection guide 2015Selection guidepdf2015-01-08
sot536-1_poplastic low profile fine-pitch ball grid array package; 96 balls; body 13.5 x 5.5 x 1.05 mmOutline drawingpdf2009-10-08
sot536-1_frFootprint for reflow soldering SOT536-1Reflow solderingpdf2009-10-08
订购信息
型号订购码 (12NC)可订购的器件编号
74LVCH322244AEC9352 639 3051874LVCH322244AEC,51
74LVCH322244AEC9352 639 3055774LVCH322244AEC;55
74LVCH322244AEC9352 639 3055174LVCH322244AEC:55
74LVCH322244AEC/G9352 811 3851874LVCH322244AEC/G,
74LVCH322244AEC/G9352 811 3855774LVCH322244AEC/G;
74LVCH322244AEC/G9352 811 3855174LVCH322244AEC/G:
模型
标题类型日期
lvch322244a IBIS modelIBIS model2013-04-07
32-bit buffer/line driver; 30 Ohm series termination resistors; 5 V tolerant input/output; 3-state 74LVCH322244AEC
74LVCH32244AEC
Interfacing 3 Volt and 5 Volt Applications 74LVC377PW
Power considerations when using CMOS and BiCMOS logic devices 74AHCT244PW
Pin FMEA for LVC family 74LVC1G123_Q100
(LF)BGA Application note, ATO Innovation 74LVC_H_16245A_Q100
ANLFBGA 32-Bit Logic Families in Low-profile Fine-pitch Ball Grid Array (LFBGA) Packages 74LVC_H_16245A_Q100
Package lead inductance considerations in high-speed applications 74LVC_H_245A_Q100
Sorting through the low voltage logic maze 74LVC_H_245A_Q100
Low voltage CMOS family - LVC 74LVC_H_245A_Q100
Logic selection guide 2016 74LVC_H_245A_Q100
plastic low profile fine-pitch ball grid array package; 96 balls; body 13.5 x 5.5 x 1.05 mm 74LVTH32245EC
Footprint for reflow soldering SOT536-1 74LVTH32245EC
lvch322244a IBIS model 74LVCH322244AEC
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