74LVT32374是设计用于3.3 V VCC操作的高性能BiCMOS产品。
74LVT32374为32位边沿触发D类触发器,具有非反相三态输出。该器件可用作四个8位触发器或两个16位触发器或一个32位触发器。在时钟(CP)进行正向跃迁时,触发器的Q输出会显示D输入处建立的逻辑电平。
特性和优势
| 产品图片 |
型号 | Product status | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Power dissipation considerations | Tamb (Cel) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Package name |
---|---|---|---|---|---|---|---|---|---|---|---|
74LVT32374EC | Production | 2.7 - 3.6 | TTL | -32/+64 | 3 | 150 | medium | -40~85 | 60 | 16.0 | LFBGA96 |
型号 | 封装 | Outline version | Reflow-/Wave soldering | 包装 | 产品状态 | 标示 | 可订购的器件编号, (订购码 (12NC)) |
---|---|---|---|---|---|---|---|
74LVT32374EC | LFBGA96 (SOT536-1) | sot536-1_po | sot536-1_fr | Tray, Bakeable, Multiple in Drypack | 量产 | LVT32374 | 74LVT32374EC,557( 9352 703 90557 ) |
Reel 13" Q1/T1 in Drypack | 量产 | LVT32374 | 74LVT32374EC,518( 9352 703 90518 ) | ||||
74LVT32374EC/G | LFBGA96 (SOT536-1) | sot536-1_po | sot536-1_fr | Tray, Bakeable, Multiple in Drypack | 量产 | LVT32374 | 74LVT32374EC/G,557( 9352 811 36557 ) |
Reel 13" Q1/T1 in Drypack | 量产 | LVT32374 | 74LVT32374EC/G,518( 9352 811 36518 ) |
型号 | 可订购的器件编号 | RoHS / RHF | 无铅转换日期 | EFR | IFR (FIT) | MTBF(小时) | 潮湿敏感度等级 | MSL LF |
---|---|---|---|---|---|---|---|---|
74LVT32374EC | 74LVT32374EC,557 | 70.8 | 1.33 | 7.52E8 | 3 | 4 | ||
74LVT32374EC | 74LVT32374EC,518 | 70.8 | 1.33 | 7.52E8 | 3 | 4 | ||
74LVT32374EC/G | 74LVT32374EC/G,557 | Always Pb-free | 70.8 | 1.33 | 7.52E8 | NA | 2 | |
74LVT32374EC/G | 74LVT32374EC/G,518 | Always Pb-free | 70.8 | 1.33 | 7.52E8 | NA | 2 |
档案名称 | 标题 | 类型 | 格式 | 日期 |
---|---|---|---|---|
74LVT32374 (中文) | 3.3 V 32-bit edge-triggered D-type flip-flop; 3-state | Data sheet | 2004-10-15 | |
AN203 | Test Fixtures for High Speed Logic | Application note | 1998-04-02 | |
AN243 | LVT (Low Voltage Technology) and ALVT (Advanced LVT) | Application note | 1998-01-01 | |
AN246 | Transmission Lines and Terminations with Philips Advanced Logic Families | Application note | 1998-02-01 | |
an2022 | The Behavior Of Integrated Bus Hold Circuits | Application note | 1996-03-01 | |
AN223 | Ground and VCC Bounce of High-Speed Integrated Circuits | Application note | 2013-03-13 | |
AN1026 | (LF)BGA Application note, ATO Innovation | Application note | 2013-03-13 | |
ANLFBGA | ANLFBGA 32-Bit Logic Families in Low-profile Fine-pitch Ball Grid Array (LFBGA) Packages | Application note | 2013-03-13 | |
AN252 | Live Insertion Aspects of Philips Logic Families | Application note | 2013-03-13 | |
AN212 | Package lead inductance considerations in high-speed applications | Application note | 2013-03-13 | |
AN10156 | Sorting through the low voltage logic maze | Application note | 2013-03-13 | |
lvt32 | lvt32 IBIS model | IBIS model | ibs | 2013-04-07 |
75017285 | Logic selection guide 2015 | Selection guide | 2015-01-08 | |
sot536-1_po | plastic low profile fine-pitch ball grid array package; 96 balls; body 13.5 x 5.5 x 1.05 mm | Outline drawing | 2009-10-08 | |
sot536-1_fr | Footprint for reflow soldering SOT536-1 | Reflow soldering | 2009-10-08 |
型号 | 订购码 (12NC) | 可订购的器件编号 |
---|---|---|
74LVT32374EC | 9352 703 90557 | 74LVT32374EC,557 |
74LVT32374EC | 9352 703 90518 | 74LVT32374EC,518 |
74LVT32374EC/G | 9352 811 36557 | 74LVT32374EC/G,557 |
74LVT32374EC/G | 9352 811 36518 | 74LVT32374EC/G,518 |
标题 | 类型 | 日期 |
---|---|---|
lvt32 IBIS model | IBIS model | 2013-04-07 |