BAS21VD: 高压开关二极管
三个高压开关二极管，采用SOT457 (SC-74/TSOP6)小型表面贴装设备（SMD）塑料封装。
BAS21VD: 产品结构框图
SOT457
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| High-voltage switching diodes (REV 4.0) PDF (222.0 kB) BAS21VD [English] | 01 Aug 2013 |
选型工具指南 (1)
| 名称/描述 | Modified Date |
|---|---|
| Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English] | 17 Feb 2016 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| plastic surface-mounted package (TSOP6); 6 leads (REV 1.0) PDF (248.0 kB) SOT457 [English] | 08 Feb 2016 |
包装 (2)
| 名称/描述 | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (187.0 kB) SOT457_135 [English] | 30 Nov 2012 |
| TSOP6; reel pack; reversed product orientation; 12NC ending 165 (REV 1.0) PDF (187.0 kB) SOT457_165 [English] | 30 Nov 2012 |
可靠性与质量信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| BAS21VD NXP Product Quality (REV 1.2) PDF (74.0 kB) BAS21VD_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BAS21VD NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BAS21VD_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
支持信息 (3)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| MAR_SOT457 Topmark (REV 1.0) PDF (113.0 kB) MAR_SOT457 [English] | 03 Jun 2013 |
SPICE
- BAS21VD SPICE model (REV 1.4) prm BAS21VD_1 7/22/2012
订购信息
| 型号 | 状态 | Package version | Package name | 大小 (mm) | VR max (V) | VR [max] (V) | IFSM max (A) | IFSM [max] (A) | VFmax (mV) | VF [max] (mV) | IR [max] (nA) | IR max (nA) | IFRM (mA) | IFRM (mA) | Configuration | trr max (ns) | trr [max] (ns) | IF [max] (mA) | IF max (mA) | Cd max. (pF) | Cd [max] (pF) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BAS21VD | Active | SOT457 | TSOP6 | 2.9 x 1.5 x 1 | 200 | 200 | 16 | 16 | 1000@IF=100mA | 1000@IF=100mA | 100@VR=200V | 100@VR=200V | 1000 | 1000 | triple isolated | 50 | 50 | 200 | 200 | 5 | 5 |
| BAS21VD/A2 | No Longer Manufactured | SOT457 | TSOP6 | 2.9 x 1.5 x 1 | 200 | 200 | 16 | 16 | 1000@IF=100mA | 1000@IF=100mA | 100@VR=200V | 100@VR=200V | 1000 | 1000 | triple isolated | 50 | 50 | 200 | 200 | 5 | 5 |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BAS21VD | | SOT457 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 13" Q3/T4 in LargePack, Reverse | Active | BAS21VD,165 (9340 576 62165) | B5 | BAS21VD |    | Always Pb-free | 347.0 | 1.61 | 6.21E8 | 1 | 1 |
| Reel 11¼" Q1/T1 in LargePack | Active | BAS21VD,135 (9340 576 62135) | B5 | BAS21VD | | week 22, 2003 | 347.0 | 1.61 | 6.21E8 | 1 | 1 |
- High-voltage switching diodes BAS21VD
- Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
- BAS21VD NXP Product Quality BAS21VD
- BAS21VD NXP® Product Reliability BAS21VD
- MAR_SOT457 Topmark 74LVC2G17_Q100
- BAS21VD SPICE model BAS21VD
- plastic surface-mounted package (TSOP6); 6 leads 74LVC2G17_Q100
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- TSOP6; reel pack; reversed product orientation; 12NC ending 165 bza456a
- Tape reel SMD; standard product orientation 12NC ending 135 bza456a
- SSL5021_SSL5031
