BF550: PNP中频晶体管
PNP中频晶体管，采用SOT23塑料封装。
SOT023
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| PNP medium frequency transistor (REV 4.0) PDF (94.0 kB) BF550 [English] | 16 Jan 2004 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| plastic surface-mounted package; 3 leads (REV 1.0) PDF (213.0 kB) SOT23 [English] | 08 Feb 2016 |
包装 (2)
| 名称/描述 | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 235 (REV 2.0) PDF (199.0 kB) SOT23_235 [English] | 05 Feb 2013 |
| Tape reel SMD; standard product orientation 12NC ending 215 (REV 1.0) PDF (202.0 kB) SOT23_215 [English] | 16 Nov 2012 |
可靠性与质量信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| BF550 NXP Product Quality (REV 1.2) PDF (74.0 kB) BF550_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BF550 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BF550_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
支持信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
Design Support
- Letter Symbols - Transistors; General (REV 0.1) PDF LSYMTRA_1 5/7/1999
SPICE
- BF550 SPICE model (REV 1.4) prm BF550_1 7/22/2012
订购信息
| 型号 | 状态 | Package version | Package name | 大小 (mm) | hFE min | Ptot (mW) | Configuration | hFE max | VCEO [max] (V) | fT min (MHz) | Ptot max (mW) | hFE [min] | IC max (mA) | IC [max] (mA) | hFE [max] | VCEO max (V) | fT [min] (MHz) | Polarity | fr [min] (MHz) | Complement |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BF550 | Active | SOT23 | TO-236AB | 2.9 x 1.3 x 1 | 50 | 250 | 1 | >50 | -40 | 325 | 250 | 50 | 25 | -25 | 40 | PNP |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BF550 | | SOT23 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 11" Q3/T4, LargePack | Active | BF550,235 (9334 509 00235) | LA% | BF550 |    | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| Reel 7" Q3/T4 | Active | BF550,215 (9334 509 00215) | LA% | BF550 | | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- BF550 NXP Product Quality BF550
- BF550 NXP® Product Reliability BF550
- Letter Symbols - Transistors; General PEMD16
- BF550 SPICE model BF550
- plastic surface-mounted package; 3 leads BSS84AK
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 235 BSS84AK
- Tape reel SMD; standard product orientation 12NC ending 215 BSS84AK
- PMBFJ309
