BGA2711：MMIC宽带放大器
硅单片微波集成电路(MMIC)宽带放大器，具有内部匹配电路，采用6针SOT363塑料SMD封装。
特性和优势
应用
| 产品图片 |
关键参数
| Symbol | Parameter | Conditions | Min | Typ/Nom | Max | Unit |
|---|---|---|---|---|---|---|
| VCC | supply voltage | 6 | V | |||
| ICC | supply current | 20 | mA | |||
| Ptot | total power dissipation | Tsp ≤ 80 °C | 200 | mW | ||
| PL(1dB) | output power at 1 dB gain compression | ISUP = 12.6 mA; f = 1000 MHz; VSUP = 5 V | -0.7 | dBm | ||
| PL(sat) | saturated output power | f = 1000 MHz | 2.8 | dBm | ||
| B-3dB | -3 dB bandwidth | VSUP = 5 V; ISUP = 12.6 mA; fmeas = 1000 MHz | 3.6 | GHz | ||
| Gp | power gain | ISUP = 12.6 mA; f = 2000 MHz; VSUP = 5 V | 13.9 | dB | ||
| Gp | power gain | ISUP = 12.6 mA; f = 1000 MHz; VSUP = 5 V | 13.1 | dB | ||
| IP3oO | output output third-order intercept point | 8.3 | dBm | |||
| NF | spot noise figure | ISUP = 12.6 mA; f = 1000 MHz; VSUP = 5 V | 4.8 | dB |
封装与包装
| 型号 | 封装 | Outline version | Reflow-/Wave soldering | 包装 | 产品状态 | 标示 | 可订购的器件编号, (订购码 (12NC)) |
|---|---|---|---|---|---|---|---|
| BGA2711 |  TSSOP6 (SOT363) | sot363_po | sot363_fr sot363_fw | Reel 7" Q1/T1 | 量产 | G2% | BGA2711,115( 9340 566 27115 ) |
引脚配置信息
| Pin | Symbol | Description | 外形简图 | 图形符号 |
|---|---|---|---|---|
| 1 | VS | supply voltage |  |  |
| 2 | GND2 | ground2 | ||
| 3 | RF_OUT | radio frequency output | ||
| 4 | GND1 | ground1 | ||
| 5 | GND2 | ground2 | ||
| 6 | RF_IN | radio frequency input |
无铅环保信息
| 型号 | 可订购的器件编号 | RoHS / RHF | 无铅转换日期 | 潮湿敏感度等级 | MSL LF |
|---|---|---|---|---|---|
| BGA2711 | BGA2711,115 |   | week 23, 2003 | NA | NA |
文档资料
| 档案名称 | 标题 | 类型 | 格式 | 日期 |
|---|---|---|---|---|
| BGA2711 (中文) | MMIC wideband amplifier | Data sheet | 2011-03-02 | |
| LSYMTRA | Letter Symbols - Transistors; General | Other type | 1999-05-07 | |
| Spar_BGA2711 | S-parameter BGA2711 | S-parameter | zip | 2012-06-06 |
| BGA2711 | BGA2711 SPICE model | SPICE model | prm | 2012-06-08 |
| sot363_fw | Footprint for wave soldering SOT363 | Wave soldering | 2009-10-08 | |
| sot363_po | plastic surface-mounted package; 6 leads | Outline drawing | 2009-10-08 | |
| sot363_fr | Footprint for reflow soldering SOT363 | Reflow soldering | 2010-07-13 | |
| SOT363_115 | TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115 | Packing | 2012-11-15 | |
| MAR_SOT363 | MAR_SOT363 Topmark | Top Marking | 2013-06-03 | |
| Reflow_Soldering_Profile | Reflow Soldering Profile | Reflow soldering | 2013-09-30 | |
| Wave_Soldering_Profile | Wave Soldering Profile | Wave soldering | 2013-09-30 |
订购信息
| 型号 | 订购码 (12NC) | 可订购的器件编号 |
|---|---|---|
| BGA2711 | 9340 566 27115 | BGA2711,115 |
模型
| 标题 | 类型 | 日期 |
|---|---|---|
| S-parameter BGA2711 | S-parameter | 2012-06-06 |
| BGA2711 SPICE model | SPICE model | 2012-06-08 |
- MMIC wideband amplifier bga2711
- Letter Symbols - Transistors; General PEMD16
- Footprint for wave soldering SOT363 BFU520Y
- plastic surface-mounted package; 6 leads BFU520Y
- Footprint for reflow soldering SOT363 BFU520Y
- TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115 BSS84AKS
- MAR_SOT363 Topmark BSS84AKS
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- S-parameter BGA2711 BGA2711
- BGA2711 SPICE model BGA2711
