硅单片微波集成电路(MMIC)宽带放大器,带内部匹配电路,提供6引脚SOT363 SMD塑料封装。
特性和优势
应用
| 产品图片 |
Symbol | Parameter | Conditions | Min | Typ/Nom | Max | Unit |
---|---|---|---|---|---|---|
VCC | supply voltage | RF input AC coupled | -0.5 | 3.6 | V | |
ICC | supply current | 55 | mA | |||
Ptot | total power dissipation | Tsp = 90 °C | 200 | mW | ||
Gp | power gain | f = 250 MHz; VSUP = 2.5 V | 30.6 | 31.2 | 31.8 | dB |
Gp | power gain | f = 500 MHz; VSUP = 2.5 V | 30.5 | 31.1 | 31.7 | dB |
Gp | power gain | f = 750 MHz; VSUP = 2.5 V | 30.3 | 31 | 31.7 | dB |
PL(1dB) | output power at 1 dB gain compression | ISUP = 16 mA; f = 750 MHz; VSUP = 2.5 V | 2 | 4 | dBm | |
IP3o | output third-order intercept point | f2 = 751 MHz; f1 = 750 MHz; Pdrive = -42 dBm (for each tone) | 11 | 13 | dBm | |
PL(sat) | saturated output power | f = 750 MHz | 3 | 4 | dBm | |
B-3dB | -3 dB bandwidth | 3 dB below gain at 1 GHz; VSUP = 2.5 V; ISUP = 16 mA | 1.9 | 2.1 | GHz |
型号 | 封装 | Outline version | Reflow-/Wave soldering | 包装 | 产品状态 | 标示 | 可订购的器件编号, (订购码 (12NC)) |
---|---|---|---|---|---|---|---|
BGA2870 | TSSOP6 (SOT363) | sot363_po | sot363_fr sot363_fw | Reel 7" Q1/T1 | 量产 | YC% | BGA2870,115( 9352 940 13115 ) |
Pin | Symbol | Description | 外形简图 | 图形符号 |
---|---|---|---|---|
1 | VCC | supply voltage | ||
2 | GND2 | ground 2 | ||
3 | RF_OUT | RF output | ||
4 | GND1 | ground 1 | ||
5 | GND2 | ground 2 | ||
6 | RF_IN | RF input |
型号 | 可订购的器件编号 | RoHS / RHF | 无铅转换日期 | 潮湿敏感度等级 | MSL LF |
---|---|---|---|---|---|
BGA2870 | BGA2870,115 | Always Pb-free | 1 | 1 |
档案名称 | 标题 | 类型 | 格式 | 日期 |
---|---|---|---|---|
BGA2870 (中文) | MMIC wideband amplifier | Data sheet | 2015-07-13 | |
75017501 | Design with confidence using our latest RF discrete | Leaflet | 2014-01-07 | |
sot363_fw | Footprint for wave soldering SOT363 | Wave soldering | 2009-10-08 | |
sot363_po | plastic surface-mounted package; 6 leads | Outline drawing | 2009-10-08 | |
sot363_fr | Footprint for reflow soldering SOT363 | Reflow soldering | 2010-07-13 | |
SOT363_115 | TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115 | Packing | 2012-11-15 | |
MAR_SOT363 | MAR_SOT363 Topmark | Top Marking | 2013-06-03 | |
Reflow_Soldering_Profile | Reflow Soldering Profile | Reflow soldering | 2013-09-30 | |
Wave_Soldering_Profile | Wave Soldering Profile | Wave soldering | 2013-09-30 |
型号 | 订购码 (12NC) | 可订购的器件编号 |
---|---|---|
BGA2870 | 9352 940 13115 | BGA2870,115 |