BGM1013：MMIC宽带放大器
硅单片微波集成电路(MMIC)宽带放大器，带内部匹配电路，提供6引脚SOT363 SMD塑料封装。
特性和优势
应用
| 产品图片 |
关键参数
| Symbol | Parameter | Conditions | Min | Typ/Nom | Max | Unit |
|---|---|---|---|---|---|---|
| VCC | supply voltage | 6 | V | |||
| ICC | supply current | 35 | mA | |||
| Ptot | total power dissipation | 200 | mW | |||
| PL(1dB) | output power at 1 dB gain compression | ISUP = 27.5 mA; f = 1000 MHz; VSUP = 5 V | 12 | 13 | dBm | |
| PL(sat) | saturated output power | f = 1000 MHz | 13 | 14 | dBm | |
| B-3dB | -3 dB bandwidth | VSUP = 5 V; ISUP = 27.5 mA; fmeas = 1000 MHz | 2.1 | GHz | ||
| Gp | power gain | ISUP = 27.5 mA; f = 100 MHz; VSUP = 5 V | 34.5 | 35.2 | 35.9 | dB |
| Gp | power gain | ISUP = 27.5 mA; f = 2200 MHz; VSUP = 5 V | 30.5 | 31.8 | 33.1 | dB |
| Gp | power gain | ISUP = 27.5 mA; f = 2600 MHz; VSUP = 5 V | 25.2 | 29.7 | 31.2 | dB |
| Gp | power gain | ISUP = 27.5 mA; f = 3000 MHz; VSUP = 5 V | 24 | 26.1 | 27.9 | dB |
| Gp | power gain | ISUP = 27.5 mA; f = 1000 MHz; VSUP = 5 V | 34.5 | 35.5 | 36.2 | dB |
| IP3o | output third-order intercept point | 21 | 22.7 | dBm | ||
| NF | spot noise figure | ISUP = 27.5 mA; f = 1000 MHz; VSUP = 5 V | 4.6 | 4.7 | dB |
封装与包装
| 型号 | 封装 | Outline version | Reflow-/Wave soldering | 包装 | 产品状态 | 标示 | 可订购的器件编号, (订购码 (12NC)) |
|---|---|---|---|---|---|---|---|
| BGM1013 |  TSSOP6 (SOT363) | sot363_po | sot363_fr sot363_fw | Reel 7" Q1/T1 | 量产 | C4% | BGM1013,115( 9340 582 47115 ) |
引脚配置信息
| Pin | Symbol | Description | 外形简图 | 图形符号 |
|---|---|---|---|---|
| 1 | VS | supply voltage |  |  |
| 2 | GND2 | ground2 | ||
| 3 | RF_OUT | radio frequency output | ||
| 4 | GND1 | ground1 | ||
| 5 | GND2 | ground2 | ||
| 6 | RF_IN | radio frequency input |
无铅环保信息
| 型号 | 可订购的器件编号 | RoHS / RHF | 无铅转换日期 | 潮湿敏感度等级 | MSL LF |
|---|---|---|---|---|---|
| BGM1013 | BGM1013,115 |   | Always Pb-free | NA | NA |
文档资料
| 档案名称 | 标题 | 类型 | 格式 | 日期 |
|---|---|---|---|---|
| BGM1013 (中文) | MMIC wideband amplifier | Data sheet | 2011-09-19 | |
| 75017501 | Design with confidence using our latest RF discrete | Leaflet | 2014-01-07 | |
| LSYMTRA | Letter Symbols - Transistors; General | Other type | 1999-05-07 | |
| Spar_BGM1013 | S-parameter BGM1013 | S-parameter | zip | 2012-06-06 |
| BGM1013 | BGM1013 SPICE model | SPICE model | prm | 2012-06-08 |
| sot363_fw | Footprint for wave soldering SOT363 | Wave soldering | 2009-10-08 | |
| sot363_po | plastic surface-mounted package; 6 leads | Outline drawing | 2009-10-08 | |
| sot363_fr | Footprint for reflow soldering SOT363 | Reflow soldering | 2010-07-13 | |
| SOT363_115 | TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115 | Packing | 2012-11-15 | |
| MAR_SOT363 | MAR_SOT363 Topmark | Top Marking | 2013-06-03 | |
| Reflow_Soldering_Profile | Reflow Soldering Profile | Reflow soldering | 2013-09-30 | |
| Wave_Soldering_Profile | Wave Soldering Profile | Wave soldering | 2013-09-30 |
订购信息
| 型号 | 订购码 (12NC) | 可订购的器件编号 |
|---|---|---|
| BGM1013 | 9340 582 47115 | BGM1013,115 |
模型
| 标题 | 类型 | 日期 |
|---|---|---|
| S-parameter BGM1013 | S-parameter | 2012-06-06 |
| BGM1013 SPICE model | SPICE model | 2012-06-08 |
- MMIC wideband amplifier bgm1013
- Design with confidence using our latest RF discrete bfu590q
- Letter Symbols - Transistors; General PEMD16
- Footprint for wave soldering SOT363 BFU520Y
- plastic surface-mounted package; 6 leads BFU520Y
- Footprint for reflow soldering SOT363 BFU520Y
- TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115 BSS84AKS
- MAR_SOT363 Topmark BSS84AKS
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- S-parameter BGM1013 BGM1013
- BGM1013 SPICE model BGM1013
