The BGU7224 is a fully integrated MMIC Low Noise Amplifier (LNA) for wireless receiver applications in the 2.4 GHz to 2.5 GHz ISM band. Manufactured in NXP's high performance SiGe:C technology, the BGU7224 couples best-in-class gain, noise figure, linearity and efficiency with the process stability and ruggedness that are the hallmarks of SiGe technology. The BGU7224 features a robust temperature-compensated internal bias network and an integral bypass / shutdown feature that stabilizes the DC operating point over temperature and enables operation in the presence of high input signals, while minimizing current consumption in bypass (standby) mode. The 1.6 mm x 1.6 mm footprint coupled with only two external component, makes the circuit board implementation of the BGU7224 the smallest IEEE 802.11b/g/n (including 256 QAM enabling “802.11n turbo”) LNA with bypass solution on the market, ideal for space sensitive applications.
特性和优势
应用
| 产品图片演示板 |
Symbol | Parameter | Conditions | Min | Typ/Nom | Max | Unit |
---|---|---|---|---|---|---|
ISUP | supply current | gain mode; VSUP = 3.3 V | 13 | mA | ||
ISUP | supply current | bypass mode; VSUP = 3.3 V | 2 | µA | ||
Pi(1dB) | input power at 1 dB gain compression | gain mode; 2400 MHz < f < 2500 MHz; VSUP = 3.3 V | -3 | dBm | ||
Gp | power gain | gain mode; 2400 MHz < f < 2500 MHz; VSUP = 3.3 V [0] | 13 | 15 | 17 | dB |
Gp | power gain | bypass mode; 2400 MHz < f < 2500 MHz; VSUP = 3.3 V [0] | -5.5 | dB | ||
NF | spot noise figure | gain mode; 2400 MHz < f < 2500 MHz [0] | 1 | dB |
型号 | 封装 | Outline version | Reflow-/Wave soldering | 包装 | 产品状态 | 标示 | 可订购的器件编号, (订购码 (12NC)) |
---|---|---|---|---|---|---|---|
BGU7224 | DFN1616-6 (SOT1189-1) | sot1189-1_po | Reflow_Soldering_Profile | Reel 7" Q1/T1 | 量产 | Standard Marking | BGU7224X( 9340 677 72115 ) |
Pin | Symbol | Description | 外形简图 | 图形符号 |
---|---|---|---|---|
1 | CTRL | gain control, switch between gain and bypass mode | ||
2 | RF_IN | RF input | ||
3 | GND | ground | ||
4 | GND | ground | ||
5 | RF_OUT | RF output | ||
6 | VCC | supply voltage | ||
7 | GND | ground |
型号 | 可订购的器件编号 | RoHS / RHF | 无铅转换日期 | 潮湿敏感度等级 | MSL LF |
---|---|---|---|---|---|
BGU7224 | BGU7224X | Always Pb-free | 1 | 1 |
档案名称 | 标题 | 类型 | 格式 | 日期 |
---|---|---|---|---|
BGU7224 (中文) | 2.4 GHz ISM SiGe:C low-noise amplifier MMIC with bypass | Data sheet | 2014-12-15 | |
Reflow_Soldering_Profile | Reflow Soldering Profile | Reflow soldering | 2013-09-30 | |
sot1189-1_po | plastic, thermal enhanced extremely thin small outline package; no leads; 6 terminals | Outline drawing | 2010-10-21 | |
sot1189-1_fr | Footprint for reflow soldering SOT1189-1 | Reflow soldering | 2011-07-06 |
型号 | 订购码 (12NC) | 可订购的器件编号 |
---|---|---|
BGU7224 | 9340 677 72115 | BGU7224X |