BLA6G1011(LS)-200R(G)：功率LDMOS晶体管
200 W LDMOS功率晶体管，用于1030 MHz至1090 MHz频率范围的航空电子应用。
特性和优势
应用
| 产品图片   |
关键参数
| 型号 | Package version | frange [min] (MHz) | frange [max] (MHz) | PL(1dB) (W) | VDS (V) | η (%) | GP (dB) | Test signal | Product status |
|---|---|---|---|---|---|---|---|---|---|
| BLA6G1011-200R | SOT502A | 1030 | 1090 | 200 | 28 | 65 | 20 | Pulsed RF; Pulsed RF | Production |
| BLA6G1011L-200RG | SOT502D | 1030 | 1090 | 200 | 28 | 65 | 20 | Pulsed RF; Pulsed RF | Production |
| BLA6G1011LS-200RG | SOT502C | 1030 | 1090 | 200 | 28 | 65 | 20 | Pulsed RF; Pulsed RF | Production |
封装与包装
| 型号 | 封装 | Outline version | Reflow-/Wave soldering | 包装 | 产品状态 | 标示 | 可订购的器件编号, (订购码 (12NC)) |
|---|---|---|---|---|---|---|---|
| BLA6G1011-200R |  (SOT502A) | sot502a_po | Bulk Pack | 量产 | Standard Marking | BLA6G1011-200R,112( 9340 636 02112 ) | |
| BLA6G1011L-200RG |  (SOT502D) | sot502d_po | Bulk Pack | 量产 | Standard Marking | BLA6G1011L-200RG,1( 9340 656 72112 ) | |
| BLA6G1011LS-200RG |  (SOT502C) | sot502c_po | Bulk Pack | 量产 | Standard Marking | BLA6G1011LS-200RG,( 9340 656 73112 ) |
无铅环保信息
| 型号 | 可订购的器件编号 | RoHS / RHF | 无铅转换日期 | 潮湿敏感度等级 | MSL LF |
|---|---|---|---|---|---|
| BLA6G1011-200R | BLA6G1011-200R,112 |   | Always Pb-free | NA | NA |
| BLA6G1011L-200RG | BLA6G1011L-200RG,1 | | Always Pb-free | NA | NA |
| BLA6G1011LS-200RG | BLA6G1011LS-200RG, | | Always Pb-free | NA | NA |
文档资料
| 档案名称 | 标题 | 类型 | 格式 | 日期 |
|---|---|---|---|---|
| BLA6G1011-200R_L-200RG_LS-200RG (中文) | Power LDMOS transistor | Data sheet | 2015-03-17 | |
| AN10896 | Mounting and Soldering of RF transistors | Application note | 2015-03-24 | |
| PCB_Design_BLA6G1011-200R_L-200RG_LS-200RG_Data-sheet | PCB Design BLA6G1011-200R & BLA6G1011L(S)-200RG (Data sheet) | Design support | zip | 2012-02-24 |
| fatigue_in_aluminum_bond_wires | Fatigue in aluminum bond wires | Mounting and soldering | 2009-10-08 | |
| high_power_rf_ldmos_transistors_for_avionics_applications | High Power RF LDMOS Transistors for Avionics Applications | Other type | 2009-01-13 | |
| NXP_RF_manual_19th_edition | RF Manual 19th edition: Application and design manual for High Performance RF products May 2015 | Other type | 2015-05-19 | |
| Application_Measurement_Report_BLA6G1011LS-200RG_1030-1090MHz_NA-1564 | Application Measurement Report BLA6G1011LS-200RG 1030-1090 MHz NA-1564 | Report | 2015-06-23 | |
| NXP_RFpower_Lib_V09p0 | RF Power Model Library for Microwave Office® | Simulation model | zip | 2014-11-11 |
| NXP_RFpower_Manual_MWO_20141111 | RF Power Model Library Manual and Installation Instructions for Microwave Office® | Simulation model | 2014-11-11 | |
| BLA6G1011-200R_ADS-2009_Model | BLA6G1011-200R ADS-2009 Model | Simulation model | zip | 2013-02-28 |
| NXP_RFPower_Simulation_Example | RF Power Simulation Example for Microwave Office® | Simulation model | zip | 2012-06-11 |
| BLD6G22L-50_ADS-2009_Model | BLD6G22L-50 ADS-2009 Model | Simulation model | zip | 2013-06-11 |
| BLA6G1011-200R_ADS-2011_Model | BLA6G1011-200R ADS-2011 Model | Simulation model | zip | 2014-04-10 |
| sot502a_po | flanged ceramic package; 2 mounting holes; 2 leads | Outline drawing | 2009-10-08 | |
| SOT502A_112 | CDFM2; blister pack; standard product orientation 12NC ending 112 | Packing | 2012-11-30 | |
| SOT502A_135 | Tape reel SMD; standard product orientation 12NC ending 135 | Packing | 2012-12-03 | |
| sot502d_po | Eared flanged ceramic package; 2 leads; 2 mounting holes | Outline drawing | 2011-04-14 | |
| sot502c_po | earless flanged ceramic package; 2 leads | Outline drawing | 2011-04-14 |
订购信息
| 型号 | 订购码 (12NC) | 可订购的器件编号 |
|---|---|---|
| BLA6G1011-200R | 9340 636 02112 | BLA6G1011-200R,112 |
| BLA6G1011L-200RG | 9340 656 72112 | BLA6G1011L-200RG,1 |
| BLA6G1011LS-200RG | 9340 656 73112 | BLA6G1011LS-200RG, |
模型
| 标题 | 类型 | 日期 |
|---|---|---|
| RF Power Model Library for Microwave Office® | Simulation model | 2014-11-11 |
| RF Power Model Library Manual and Installation Instructions for Microwave Office® | Simulation model | 2014-11-11 |
| BLA6G1011-200R ADS-2009 Model | Simulation model | 2013-02-28 |
| RF Power Simulation Example for Microwave Office® | Simulation model | 2012-06-11 |
| BLD6G22L-50 ADS-2009 Model | Simulation model | 2013-06-11 |
| BLA6G1011-200R ADS-2011 Model | Simulation model | 2014-04-10 |
其它
| 标题 | 类型 | 日期 |
|---|---|---|
| PCB Design BLA6G1011-200R & BLA6G1011L(S)-200RG (Data sheet) | Design support | 2012-02-24 |
- Power LDMOS transistor BLA6G1011_LS_200R_G
- Power LDMOS transistor BLA6G1011_LS_200R_G
- Power LDMOS transistor BLA6G1011_LS_200R_G
- Power LDMOS transistor BLA6G1011_LS_200R_G
- Mounting and Soldering of RF transistors aerospace_defense
- Fatigue in aluminum bond wires gan_devices
- High Power RF LDMOS Transistors for Avionics Applications avionics_ldmos_transistors
- RF Manual 19th edition: Application and design manual for High Performance RF products May 2015 rf
- Application Measurement Report BLA6G1011LS-200RG 1030-1090 MHz NA-1564 BLA6G1011_LS_200R_G
- flanged ceramic package; 2 mounting holes; 2 leads BLS7G2325L-105
- CDFM2; blister pack; standard product orientation 12NC ending 112 BLS7G2325L-105
- Tape reel SMD; standard product orientation 12NC ending 135 BLS6G3135_S_120
- Eared flanged ceramic package; 2 leads; 2 mounting holes BLA6G1011_LS_200R_G
- earless flanged ceramic package; 2 leads BLA6G1011_LS_200R_G
- RF Power Model Library for Microwave Office® CLF1G0060_S_30
- RF Power Model Library Manual and Installation Instructions for Microwave Office® CLF1G0060_S_30
- BLA6G1011-200R ADS-2009 Model BLA6G1011_LS_200R_G
- RF Power Simulation Example for Microwave Office® CLF1G0060_S_30
- BLD6G22L-50 ADS-2009 Model BLA6G1011_LS_200R_G
- BLA6G1011-200R ADS-2011 Model BLA6G1011_LS_200R_G
- PCB Design BLA6G1011-200R & BLA6G1011L(S)-200RG (Data sheet) BLA6G1011_LS_200R_G
