BLF174XR：功率LDMOS晶体管
600 W极耐用LDMOS功率晶体管，用于HF至128 MHz频段广播和工业应用。
特性和优势
应用
| 产品图片 |
关键参数
| Symbol | Parameter | Conditions | Min | Typ/Nom | Max | Unit |
|---|---|---|---|---|---|---|
| frange | frequency range | 10 | 128 | MHz | ||
| PL(1dB) | nominal output power at 1 dB gain compression | 600 | W | |||
| Gp | power gain | PL = 600 W; VDS = 50 V | 29 | dB | ||
| ηD | drain efficiency | PL = 600 W; VDS = 50 V; f = 108 MHz; IDq = 100 mA | 73 | % |
封装与包装
| 型号 | 封装 | Outline version | Reflow-/Wave soldering | 包装 | 产品状态 | 标示 | 可订购的器件编号, (订购码 (12NC)) |
|---|---|---|---|---|---|---|---|
| BLF174XR |  (SOT1214A) | sot1214a_po | Bulk Pack | 量产 | Standard Marking | BLF174XR,112( 9340 670 84112 ) |
引脚配置信息
| Pin | Symbol | Description | 外形简图 | 图形符号 |
|---|---|---|---|---|
| 1 | D1 | drain1 |  |  |
| 2 | D2 | drain2 | ||
| 3 | G1 | gate1 | ||
| 4 | G2 | gate2 | ||
| 5 | S | source |
无铅环保信息
| 型号 | 可订购的器件编号 | RoHS / RHF | 无铅转换日期 | 潮湿敏感度等级 | MSL LF |
|---|---|---|---|---|---|
| BLF174XR | BLF174XR,112 |   | Always Pb-free |
文档资料
| 档案名称 | 标题 | 类型 | 格式 | 日期 |
|---|---|---|---|---|
| BLF174XR_BLF174XRS (中文) | Power LDMOS transistor | Data sheet | 2013-06-25 | |
| AN10896 | Mounting and Soldering of RF transistors | Application note | 2015-03-24 | |
| PCB_Design_BLF174XR_BLF174XRS_Data-sheet | PCB Design BLF174XR(S) (Data sheet) | Design support | zip | 2013-06-27 |
| fatigue_in_aluminum_bond_wires | Fatigue in aluminum bond wires | Mounting and soldering | 2009-10-08 | |
| NXP_RF_manual_19th_edition | RF Manual 19th edition: Application and design manual for High Performance RF products May 2015 | Other type | 2015-05-19 | |
| NXP_RFpower_Lib_V09p0 | RF Power Model Library for Microwave Office® | Simulation model | zip | 2014-11-11 |
| NXP_RFpower_Manual_MWO_20141111 | RF Power Model Library Manual and Installation Instructions for Microwave Office® | Simulation model | 2014-11-11 | |
| NXP_RFPower_Simulation_Example | RF Power Simulation Example for Microwave Office® | Simulation model | zip | 2012-06-11 |
| BLF174XR_ADS-2009_Model | BLF174XR ADS-2009 Model | Simulation model | zip | 2013-06-11 |
| sot1214a_po | flanged ceramic package; 2 mounting holes; 4 leads | Outline drawing | 2012-10-10 |
订购信息
| 型号 | 订购码 (12NC) | 可订购的器件编号 |
|---|---|---|
| BLF174XR | 9340 670 84112 | BLF174XR,112 |
模型
| 标题 | 类型 | 日期 |
|---|---|---|
| RF Power Model Library for Microwave Office® | Simulation model | 2014-11-11 |
| RF Power Model Library Manual and Installation Instructions for Microwave Office® | Simulation model | 2014-11-11 |
| RF Power Simulation Example for Microwave Office® | Simulation model | 2012-06-11 |
| BLF174XR ADS-2009 Model | Simulation model | 2013-06-11 |
其它
| 标题 | 类型 | 日期 |
|---|---|---|
| PCB Design BLF174XR(S) (Data sheet) | Design support | 2013-06-27 |
- Power LDMOS transistor BLF174XR_S
- Power LDMOS transistor BLF174XR_S
- Power LDMOS transistor BLF174XR_S
- Mounting and Soldering of RF transistors aerospace_defense
- Fatigue in aluminum bond wires gan_devices
- RF Manual 19th edition: Application and design manual for High Performance RF products May 2015 rf
- flanged ceramic package; 2 mounting holes; 4 leads BLF574XR_S
- RF Power Model Library for Microwave Office® CLF1G0060_S_30
- RF Power Model Library Manual and Installation Instructions for Microwave Office® CLF1G0060_S_30
- RF Power Simulation Example for Microwave Office® CLF1G0060_S_30
- BLF174XR ADS-2009 Model BLF174XR_S
- PCB Design BLF174XR(S) (Data sheet) BLF174XR_S
