BLF573(S)：HF/VHF功率LDMOS晶体管 _ BDTIC 中国领先电子元器件代理商

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BLF573(S)：HF/VHF功率LDMOS晶体管

300 W LDMOS RF功率晶体管，适用于HF至500 MHz频段广播应用以及工业、科学和医疗应用。

特性和优势

方便的功率控制
集成ESD保护
极佳的强度
高效率
极佳的热稳定性
主要用于宽带操作（HF和VHF波段）
符合有害物质限制的Directive 2002/95/EC

应用

工业、科学和医疗应用
广播发射器应用

产品图片

关键参数

型号	Package version	f_range [min] (MHz)	f_range [max] (MHz)	P_L(1dB) (W)	V_DS (V)	η (%)	G_P (dB)	Test signal	Product status
BLF573	SOT502A	10	500	300	50	70	27.2	CW; CW	Production
BLF573S	SOT502B	10	500	300	50	70	27.2	CW; CW	Production

封装与包装

型号	封装	Outline version	Reflow-/Wave soldering	包装	产品状态	标示	可订购的器件编号, (订购码 (12NC))
BLF573	(SOT502A)	sot502a_po		Bulk Pack	量产	Standard Marking	BLF573,112( 9340 644 45112 )
BLF573S	(SOT502B)	sot502b_po		Bulk Pack	量产	Standard Marking	BLF573S,112( 9340 621 75112 )

无铅环保信息

型号	可订购的器件编号	RoHS / RHF	无铅转换日期	潮湿敏感度等级	MSL LF
BLF573	BLF573,112		Always Pb-free	NA	NA
BLF573S	BLF573S,112		Always Pb-free		NA

文档资料

档案名称	标题	类型	格式	日期
BLF573_BLF573S (中文)	HF / VHF power LDMOS transistor	Data sheet	pdf	2010-07-08
AN10896	Mounting and Soldering of RF transistors	Application note	pdf	2015-03-24
PCB_Design_BLF573_BLF573S_Data-sheet	PCB Design BLF573(S) (Data sheet)	Design support	zip	2012-02-24
fatigue_in_aluminum_bond_wires	Fatigue in aluminum bond wires	Mounting and soldering	pdf	2009-10-08
NXP_RF_manual_19th_edition	RF Manual 19th edition: Application and design manual for High Performance RF products May 2015	Other type	pdf	2015-05-19
BLF573_ADS-2009_Model	BLF573 ADS-2009 Model	Simulation model	zip	2013-06-20
NXP_RFpower_Lib_V09p0	RF Power Model Library for Microwave Office®	Simulation model	zip	2014-11-11
NXP_RFpower_Manual_MWO_20141111	RF Power Model Library Manual and Installation Instructions for Microwave Office®	Simulation model	pdf	2014-11-11
NXP_RFPower_Simulation_Example	RF Power Simulation Example for Microwave Office®	Simulation model	zip	2012-06-11
sot502b_po	earless flanged ceramic package; 2 leads	Outline drawing	pdf	2007-05-08
SOT502B_112	CDFM2; blister pack; standard product orientation 12NC ending 112	Packing	pdf	2012-12-03
sot502a_po	flanged ceramic package; 2 mounting holes; 2 leads	Outline drawing	pdf	2009-10-08
SOT502A_112	CDFM2; blister pack; standard product orientation 12NC ending 112	Packing	pdf	2012-11-30
SOT502A_135	Tape reel SMD; standard product orientation 12NC ending 135	Packing	pdf	2012-12-03

订购信息

型号	订购码 (12NC)	可订购的器件编号
BLF573	9340 644 45112	BLF573,112
BLF573S	9340 621 75112	BLF573S,112

模型

标题	类型	日期
BLF573 ADS-2009 Model	Simulation model	2013-06-20
RF Power Model Library for Microwave Office®	Simulation model	2014-11-11
RF Power Model Library Manual and Installation Instructions for Microwave Office®	Simulation model	2014-11-11
RF Power Simulation Example for Microwave Office®	Simulation model	2012-06-11

其它

标题	类型	日期
PCB Design BLF573(S) (Data sheet)	Design support	2012-02-24

HF / VHF power LDMOS transistor BLF573_S

HF / VHF power LDMOS transistor BLF573_S

HF / VHF power LDMOS transistor BLF573_S

Mounting and Soldering of RF transistors aerospace_defense

Fatigue in aluminum bond wires gan_devices

RF Manual 19th edition: Application and design manual for High Performance RF products May 2015 rf

earless flanged ceramic package; 2 leads BLS7G3135LS-200

CDFM2; blister pack; standard product orientation 12NC ending 112 BLS7G3135LS-200

flanged ceramic package; 2 mounting holes; 2 leads BLS7G2325L-105

CDFM2; blister pack; standard product orientation 12NC ending 112 BLS7G2325L-105

Tape reel SMD; standard product orientation 12NC ending 135 BLS6G3135_S_120

BLF573 ADS-2009 Model BLF573_S

RF Power Model Library for Microwave Office® CLF1G0060_S_30

RF Power Model Library Manual and Installation Instructions for Microwave Office® CLF1G0060_S_30

RF Power Simulation Example for Microwave Office® CLF1G0060_S_30

PCB Design BLF573(S) (Data sheet) BLF573_S

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