BLF871_BLF871S (中文) | UHF power LDMOS transistor | Data sheet | pdf | 2010-06-25 |
AN10896 | Mounting and Soldering of RF transistors | Application note | pdf | 2015-03-24 |
PCB_Design_BLF871_BLF871S_Data-sheet | PCB Design BLF871(S) (Data sheet) | Design support | zip | 2012-02-24 |
fatigue_in_aluminum_bond_wires | Fatigue in aluminum bond wires | Mounting and soldering | pdf | 2009-10-08 |
high_voltage_rf_ldmos_technology_for_broadcast_applications | High Voltage RF LDMOS Technology for Broadcast Applications | Other type | pdf | 2009-01-13 |
NXP_RF_manual_19th_edition | RF Manual 19th edition: Application and design manual for High Performance RF products May 2015 | Other type | pdf | 2015-05-19 |
Application_Measurement_Report_BLF871_470-860MHz_NA-1329 | Application Measurement Report BLF871 470-860 MHz NA-1329 | Report | pdf | 2015-06-23 |
BLF871_ADS-2009_Model | BLF871 ADS-2009 Model | Simulation model | zip | 2013-04-02 |
NXP_RFpower_Lib_V09p0 | RF Power Model Library for Microwave Office® | Simulation model | zip | 2014-11-11 |
NXP_RFpower_Manual_MWO_20141111 | RF Power Model Library Manual and Installation Instructions for Microwave Office® | Simulation model | pdf | 2014-11-11 |
NXP_RFPower_Simulation_Example | RF Power Simulation Example for Microwave Office® | Simulation model | zip | 2012-06-11 |
BLF871_ADS-2011_Model | BLF871 ADS-2011 Model | Simulation model | zip | 2014-04-11 |
sot467c_po | flanged ceramic package; 2 mounting holes; 2 leads | Outline drawing | pdf | 1999-12-27 |
SOT467C_112 | CDFM2; blister pack; standard product orientation 12NC ending 112 | Packing | pdf | 2012-11-30 |
sot467b_po | earless ceramic package; 2 leads | Outline drawing | pdf | 2012-05-08 |