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PCB_Design_BLL6H1214L-250_1214LS-250_Data-sheet | PCB Design BLL6H1214L(S)-250 (Data sheet) | Design support | zip | 2012-02-24 |
fatigue_in_aluminum_bond_wires | Fatigue in aluminum bond wires | Mounting and soldering | pdf | 2009-10-08 |
NXP_RF_manual_19th_edition | RF Manual 19th edition: Application and design manual for High Performance RF products May 2015 | Other type | pdf | 2015-05-19 |
NXP_RFpower_Lib_V09p0 | RF Power Model Library for Microwave Office® | Simulation model | zip | 2014-11-11 |
NXP_RFpower_Manual_MWO_20141111 | RF Power Model Library Manual and Installation Instructions for Microwave Office® | Simulation model | pdf | 2014-11-11 |
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NXP_RFPower_Simulation_Example | RF Power Simulation Example for Microwave Office® | Simulation model | zip | 2012-06-11 |
BLL6H1214-250_ADS-2011_Model | BLL6H1214-250 ADS-2011 Model | Simulation model | zip | 2014-04-11 |
sot502b_po | earless flanged ceramic package; 2 leads | Outline drawing | pdf | 2007-05-08 |
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sot502a_po | flanged ceramic package; 2 mounting holes; 2 leads | Outline drawing | pdf | 2009-10-08 |
SOT502A_112 | CDFM2; blister pack; standard product orientation 12NC ending 112 | Packing | pdf | 2012-11-30 |
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