数据手册DataSheet 下载BLM7G1822S-20PB LDMOS 2-stage power MMIC.pdf

The BLM7G1822S-20PB(G) is a dual section, 2-stage power MMIC using NXP’s state of the art GEN7 LDMOS technology. This multiband device is perfectly suited as general purpose driver or small cell final in the frequency range from 1805 MHz to 2170 MHz. Available in gull wing or straight lead outline.

产品特点
  • Designed for broadband operation (frequency 1805 MHz to 2170 MHz)
  • High section-to-section isolation enabling multiple combinations
  • Integrated temperature compensated bias
  • Biasing of individual stages is externally accessible
  • Integrated ESD protection
  • Excellent thermal stability
  • High power gain
  • On-chip matching for ease of use
  • Compliant to Directive 2002/95/EC, regarding restriction of hazardous substances (RoHS)
产品应用
  • RF power MMIC for W-CDMA base stations in the 1805 MHz to 2170 MHz frequency range. Possible circuit topologies are the following:
    • Dual section or single ended
    • Doherty
    • Quadrature combined
    • Push-pull
订购型号
订购型号封装Outline versionReflow-/Wave soldering包装产品状态标示订购器件的编号
BLM7G1822S-20PBHSOP16F (SOT1211-1)sot1211-1_poReel Dry Pack, SMD, 13" Q1/T1激活Standard MarkingBLM7G1822S-20PBY( 9340 683 55518 )
品质、可靠性及RoHS化学成分
订购型号订购器件的编号RoHS / RHF无铅开始日期EFRIFR (FIT)MTBF(小时)潮湿敏感度等级MSL LF
BLM7G1822S-20PBBLM7G1822S-20PBY33
产品技术资料
文档标题类型分类格式更新日期
BLM7G1822S-20PB_S-20PBG (中文):LDMOS 2-stage power MMICData sheetpdf2014-06-26
AN11183:Mounting and soldering of RF transistors in over-molded plastic packagesApplication notepdf2012-11-06
75017347:Enabling the Mobile ExperienceBrochurepdf2013-02-05
PCB_Design_BLM7G1822S-20PB_S-20PBG_Data-sheet:PCB Design BLM7G1822S-20PB(G) (Data sheet)Design supportzip2014-05-22
fatigue_in_aluminum_bond_wires:Fatigue in aluminum bond wiresMounting and solderingpdf2009-10-08
75017565:NXP's RF Manual 18th editionSelection guidepdf2014-06-17
BLM7G1822S-20PB_ADS-2012_Model:BLM7G1822S-20PB ADS-2012 ModelSimulation modelzip2014-06-06
sot1211-1_po:plastic, heatsink small outline package; 16 leads(flat)Outline drawingpdf2013-06-25
LDMOS 2-stage power MMIC BLM7G1822S_20PB_G
LDMOS 2-stage power MMIC BLM7G1822S_20PB_G
LDMOS 2-stage power MMIC BLM7G1822S_20PB_G
Mounting and soldering of RF transistors in over-molded plastic packages BLP8G21S-160PV
Enabling the Mobile Experience rf
PCB Design BLM7G1822S-20PB(G) (Data sheet) BLM7G1822S_20PB_G
Fatigue in aluminum bond wires gan_devices
NXP's RF Manual 18th edition OL2300NHN
BLM7G1822S-20PB ADS-2012 Model BLM7G1822S_20PB_G
plastic, heatsink small outline package; 16 leads(flat) BLM8G0710S-45AB