数据手册DataSheet 下载：BLM7G1822S-40PB LDMOS 2级功率MMIC.pdf
BLM7G1822S-40PB(G)是采用恩智浦最先进GEN7 LDMOS技术的双路径2级功率MMIC。该多频段器件非常适合用作1805 MHz至2170 MHz频率范围内的通用驱动器或小型蜂窝中的末级。采用鸥翼式或直引脚外形。
产品特点
| 产品应用
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订购型号
| 订购型号 | 封装 | Outline version | Reflow-/Wave soldering | 包装 | 产品状态 | 标示 | 订购器件的编号 |
| BLM7G1822S-40PB | HSOP16F (SOT1211-1) | sot1211-1_po | Reel Dry Pack, SMD, 13" Q1/T1 | 激活 | Standard Marking | BLM7G1822S-40PBY( 9340 680 86518 ) |
品质、可靠性及RoHS化学成分
| 订购型号 | 订购器件的编号 | RoHS / RHF | 无铅开始日期 | EFR | IFR (FIT) | MTBF（小时） | 潮湿敏感度等级 | MSL LF |
| BLM7G1822S-40PB | BLM7G1822S-40PBY |   | 3 | 3 |
产品技术资料
| 文档标题 | 类型分类 | 格式 | 更新日期 |
| BLM7G1822S-40PB_S-40PBG (中文)：LDMOS 2-stage power MMIC | Data sheet | 2014-03-24 | |
| AN11183：Mounting and soldering of RF transistors in over-molded plastic packages | Application note | 2012-11-06 | |
| 75017347：Enabling the Mobile Experience | Brochure | 2013-02-05 | |
| PCB_Design_BLM7G1822S-40PB_S-40PBG_Data-sheet：PCB Design BLM7G1822S-40PB(G) (Data sheet) | Design support | zip | 2014-02-24 |
| fatigue_in_aluminum_bond_wires：Fatigue in aluminum bond wires | Mounting and soldering | 2009-10-08 | |
| 75017565：NXP's RF Manual 18th edition | Selection guide | 2014-06-17 | |
| sot1211-1_po：plastic, heatsink small outline package; 16 leads(flat) | Outline drawing | 2013-06-25 |
- LDMOS 2-stage power MMIC BLM7G1822S_40PB_G
- LDMOS 2-stage power MMIC BLM7G1822S_40PB_G
- LDMOS 2-stage power MMIC BLM7G1822S_40PB_G
- Mounting and soldering of RF transistors in over-molded plastic packages BLP8G21S-160PV
- Enabling the Mobile Experience rf
- PCB Design BLM7G1822S-40PB(G) (Data sheet) BLM7G1822S_40PB_G
- Fatigue in aluminum bond wires gan_devices
- NXP's RF Manual 18th edition OL2300NHN
- plastic, heatsink small outline package; 16 leads(flat) BLM8G0710S-45AB
