数据手册DataSheet 下载BLM7G1822S-40PBG LDMOS 2级功率MMIC.pdf

BLM7G1822S-40PB(G)是采用恩智浦最先进GEN7 LDMOS技术的双路径2级功率MMIC。该多频段器件非常适合用作1805 MHz至2170 MHz频率范围内的通用驱动器或小型蜂窝中的末级。采用鸥翼式或直引脚外形。

产品特点
  • 设计用于宽带操作(频率1805 MHz至2170 MHz)
  • 路径间的隔离度高,可实现多个组合
  • 集成式温度补偿偏置
  • 单级偏置可以从外部访问
  • 集成式ESD保护
  • 极佳的热稳定性
  • 高功率增益
  • 片上匹配,便于使用
  • 符合欧盟2002/95/EC危害性物质限制(RoHS)指令
产品应用
  • 适用于1805 MHz至2170 MHz频率范围内W-CDMA基站的RF功率MMIC 可能采用的电路拓扑结构如下:
订购型号
订购型号封装Outline versionReflow-/Wave soldering包装产品状态标示订购器件的编号
BLM7G1822S-40PBGHSOP16 (SOT1212-1)sot1212-1_poReel Dry Pack, SMD, 13" Q1/T1激活Standard MarkingBLM7G1822S-40PBGY( 9340 680 87518 )
品质、可靠性及RoHS化学成分
订购型号订购器件的编号RoHS / RHF无铅开始日期EFRIFR (FIT)MTBF(小时)潮湿敏感度等级MSL LF
BLM7G1822S-40PBGBLM7G1822S-40PBGY33
产品技术资料
文档标题类型分类格式更新日期
BLM7G1822S-40PB_S-40PBG (中文):LDMOS 2-stage power MMICData sheetpdf2014-03-24
AN11183:Mounting and soldering of RF transistors in over-molded plastic packagesApplication notepdf2012-11-06
75017347:Enabling the Mobile ExperienceBrochurepdf2013-02-05
PCB_Design_BLM7G1822S-40PB_S-40PBG_Data-sheet:PCB Design BLM7G1822S-40PB(G) (Data sheet)Design supportzip2014-02-24
fatigue_in_aluminum_bond_wires:Fatigue in aluminum bond wiresMounting and solderingpdf2009-10-08
75017565:NXP's RF Manual 18th editionSelection guidepdf2014-06-17
BLM7G1822S-40PBG_ADS-2012_Model:BLM7G1822S-40PBG ADS-2012 ModelSimulation modelzip2013-11-22
sot1212-1_po:plastic, heatsink small outline package; 16 leads(flat)Outline drawingpdf2012-04-17
LDMOS 2-stage power MMIC BLM7G1822S_40PB_G
LDMOS 2-stage power MMIC BLM7G1822S_40PB_G
LDMOS 2-stage power MMIC BLM7G1822S_40PB_G
Mounting and soldering of RF transistors in over-molded plastic packages BLP8G21S-160PV
Enabling the Mobile Experience rf
PCB Design BLM7G1822S-40PB(G) (Data sheet) BLM7G1822S_40PB_G
Fatigue in aluminum bond wires gan_devices
NXP's RF Manual 18th edition OL2300NHN
BLM7G1822S-40PBG ADS-2012 Model BLM7G1822S_40PB_G
plastic, heatsink small outline package; 16 leads(flat) BLM8G0710S-45ABG