BLP05M7200:Power LDMOS transistor

200 W LDMOS power transistor for various applications such as ISM and RF plasma lighting at frequencies from 425 MHz to 450 MHz

特性和优势
    • High efficiency
    • Excellent ruggedness
    • Excellent thermal stability
    • Integrated ESD protection
    • Easy power control
    • Designed for ISM operation (425 MHz to 450 MHz
    • Input integration for simple board design
      • Tcase = 25 °C, IDq
    • Tcase = 25 °C, IDq
    • Compliant to Directive 2002/95/EC, regarding Restriction of Hazardous Substances (RoHS)
应用
    • RF power amplifiers for CW applications in the 425 MHz - 450 MH
产品图片
关键参数
SymbolParameterConditionsMinTyp/NomMaxUnit
frangefrequency range425450MHz
PL(1dB)nominal output power at 1 dB gain compression200W
Gppower gainPL = 210 W; VDS = 28 V19.521dB
RLininput return lossPL = 210 W; VDS = 28 V; IDq = 2 mA-15-11dB
ηDdrain efficiencyPL = 210 W; VDS = 28 V; f = 440 MHz; IDq = 2 mA7377%
封装与包装
型号封装Outline versionReflow-/Wave soldering包装产品状态标示可订购的器件编号, (订购码 (12NC))
BLP05M7200
HSOP4F
(SOT1138-1)
sot1138-1_poReel 13" Q1/T1 in Drypack量产Standard MarkingBLP05M7200Y( 9340 673 79518 )
引脚配置信息
PinSymbolDescription外形简图图形符号
1DRAINdrain
2DRAINdrain
3GATEgate
4GATEgate
5SOURCEsource
无铅环保信息
型号可订购的器件编号RoHS / RHF无铅转换日期潮湿敏感度等级MSL LF
BLP05M7200BLP05M7200Y33
文档资料
档案名称标题类型格式日期
BLP05M7200 (中文)Power LDMOS transistorData sheetpdf2013-11-18
AN11183Mounting and soldering of RF transistors in over-molded plastic packagesApplication notepdf2012-11-06
PCB_Design_BLP05M7200_Data-sheetPCB Design BLP05M7200 (Data sheet)Design supportzip2013-10-25
fatigue_in_aluminum_bond_wiresFatigue in aluminum bond wiresMounting and solderingpdf2009-10-08
NXP_RF_manual_19th_editionRF Manual 19th edition: Application and design manual for High Performance RF products May 2015Other typepdf2015-05-19
sot1138-1_poplastic, heatsink small outline package; 4 leads(flat)Outline drawingpdf2012-09-25
订购信息
型号订购码 (12NC)可订购的器件编号
BLP05M72009340 673 79518BLP05M7200Y
其它
标题类型日期
PCB Design BLP05M7200 (Data sheet)Design support2013-10-25
Power LDMOS transistor BLP05M7200
Mounting and soldering of RF transistors in over-molded plastic packages BLP8G21S-160PV
Fatigue in aluminum bond wires gan_devices
RF Manual 19th edition: Application and design manual for High Performance RF products May 2015 rf
plastic, heatsink small outline package; 4 leads(flat) BLP05M7200
PCB Design BLP05M7200 (Data sheet) BLP05M7200