BLP10H610：宽带LDMOS驱动器晶体管

10 W塑料LDMOS功率晶体管，适合于频率范围为HF至1400 MHz的广播发射器和ISM应用。

特性和优势
    • 轻松控制功率
    • 集成ESD保护
    • 极佳的抗失配性
    • 高效
    • 极佳的热稳定性
    • 专为宽带应用设计（HF至1400 MHz）
    • 符合欧盟2002/95/EC危害性物质限制(RoHS)指令
应用
    • 工业、科学和医疗应用
    • 广播发射器应用
产品图片
关键参数
SymbolParameterConditionsMinTyp/NomMaxUnit
frangefrequency range101400MHz
PL(1dB)nominal output power at 1 dB gain compression10W
Gppower gainPL = 10 W; VDS = 50 V19.32225.7dB
ηDdrain efficiencyPL = 10 W; VDS = 50 V; f = 860 MHz; IDq = 60 mA56.860%
封装与包装
型号封装Outline versionReflow-/Wave soldering包装产品状态标示可订购的器件编号, (订购码 (12NC))
BLP10H610
HVSON12
(SOT1352-1)		sot1352-1_posot1352-1_frReel 7" Q1/T1 in DryPack, SmallPack量产Standard MarkingBLP10H610AZ( 9340 682 15531 )
Reel 7" Q1/T1 in Drypack量产Standard MarkingBLP10H610Z( 9340 682 15515 )
引脚配置信息
PinSymbolDescription外形简图图形符号
1n.c.not connected
2GATE1gate1
3GATE1gate1
4GATE2gate2
5GATE2gate2
6n.c.not connected
7n.c.not connected
8DRAIN2drain2
9DRAIN2drain2
10DRAIN1drain1
11DRAIN1drain1
12n.c.not connected
13SOURCEsource
无铅环保信息
型号可订购的器件编号RoHS / RHF无铅转换日期潮湿敏感度等级MSL LF
BLP10H610BLP10H610AZAlways Pb-free33
BLP10H610BLP10H610Zweek 18, 201433
文档资料
档案名称标题类型格式日期
BLP10H610 (中文)Broadband LDMOS driver transistorData sheetpdf2014-09-25
AN10896Mounting and Soldering of RF transistorsApplication notepdf2015-03-24
AN11520Life-time requirements of NXP Semiconductors HVSON12 plastic driversApplication notepdf2014-04-04
PCB_Design_BLP10H610_Data-sheetPCB Design BLP10H610 (Data sheet)Design supportzip2014-08-19
fatigue_in_aluminum_bond_wiresFatigue in aluminum bond wiresMounting and solderingpdf2009-10-08
NXP_RF_manual_19th_editionRF Manual 19th edition: Application and design manual for High Performance RF products May 2015Other typepdf2015-05-19
RFPower_Longevity_OverviewRF Power Longevity OverviewOther typepdf2014-09-09
Application_Measurement_Report_BLP10H610_174-230MHz_CA-448-13Application Measurement Report BLP10H610 174-230 MHz CA-448-13Reportpdf2015-06-23
Application_Measurement_Report_BLP10H610_1200-1400MHz_CA-281-14Application Measurement Report BLP10H610 1200-1400 MHz CA-281-14Reportpdf2015-06-23
Application_Measurement_Report_BLP10H610_1800-3000MHz_CA-190-14Application Measurement Report BLP10H610 1800-3000 MHz CA-190-14Reportpdf2015-06-23
Application_Measurement_Report_BLP10H610_20-520MHz_CA-005-14Application Measurement Report BLP10H610 20-520 MHz CA-005-14Reportpdf2015-06-23
Application_Measurement_Report_BLP10H610_400-450MHz_CA-329-13Application Measurement Report BLP10H610 400-450 MHz CA-329-13Reportpdf2015-06-23
Application_Measurement_Report_BLP10H610_50-70MHz_CA-251-13Application Measurement Report BLP10H610 50-70 MHz CA-251-13Reportpdf2015-06-23
Application_Measurement_Report_BLP10H610_225-450MHz_CA-461-14Application Measurement Report BLP10H610 225-450 MHz CA-461-14Reportpdf2015-06-23
Application_Measurement_Report_BLP10H610_25-29MHz_CA-420-13Application Measurement Report BLP10H610 25-29 MHz CA-420-13Reportpdf2015-06-23
Application_Measurement_Report_BLP10H610_30-50MHz_CA-250-13Application Measurement Report BLP10H610 30-50 MHz CA-250-13Reportpdf2015-06-23
Application_Measurement_Report_BLP10H610_70-90MHz_CA-252-13Application Measurement Report BLP10H610 50-70 MHz CA-251-13Reportpdf2015-06-23
Application_Measurement_Report_BLP10H610_88-108MHz_CA-253-13Application Measurement Report BLP10H610 88-108 MHz CA-253-13Reportpdf2015-06-23
Application_Measurement_Report_BLP10H610_950-1225MHz_CA-335-13Application Measurement Report BLP10H610 950-1225 MHz CA-335-13Reportpdf2015-06-23
Application_Measurement_Report_BLP10H610_BLA6H0912-500_1030-1090MHz_NA-1938Application Measurement Report BLP10H610 + BLA6H0912-500 1030-1090 MHz NA-1938Reportpdf2015-06-23
sot1352-1_poplastic thermal enhanced very thin small outline package; no leads; 12 terminalsOutline drawingpdf2013-03-27
sot1352-1_frFootprint for reflow soldering SOT1352-1Reflow solderingpdf2013-06-05
订购信息
型号订购码 (12NC)可订购的器件编号
BLP10H6109340 682 15531BLP10H610AZ
BLP10H6109340 682 15515BLP10H610Z
其它
标题类型日期
PCB Design BLP10H610 (Data sheet)Design support2014-08-19
Broadband LDMOS driver transistor BLP10H610
Mounting and Soldering of RF transistors aerospace_defense
Life-time requirements of NXP Semiconductors HVSON12 plastic drivers BLP10H610
Fatigue in aluminum bond wires gan_devices
RF Manual 19th edition: Application and design manual for High Performance RF products May 2015 rf
RF Power Longevity Overview gan_devices
Application Measurement Report BLP10H610 174-230 MHz CA-448-13 BLP10H610
Application Measurement Report BLP10H610 1200-1400 MHz CA-281-14 BLP10H610
Application Measurement Report BLP10H610 1800-3000 MHz CA-190-14 BLP10H610
Application Measurement Report BLP10H610 20-520 MHz CA-005-14 BLP10H610
Application Measurement Report BLP10H610 400-450 MHz CA-329-13 BLP10H610
Application Measurement Report BLP10H610 50-70 MHz CA-251-13 BLP10H610
Application Measurement Report BLP10H610 225-450 MHz CA-461-14 BLP10H610
Application Measurement Report BLP10H610 25-29 MHz CA-420-13 BLP10H610
Application Measurement Report BLP10H610 30-50 MHz CA-250-13 BLP10H610
Application Measurement Report BLP10H610 50-70 MHz CA-251-13 BLP10H610
Application Measurement Report BLP10H610 88-108 MHz CA-253-13 BLP10H610
Application Measurement Report BLP10H610 950-1225 MHz CA-335-13 BLP10H610
Application Measurement Report BLP10H610 + BLA6H0912-500 1030-1090 MHz NA-1938 BLP10H610
plastic thermal enhanced very thin small outline package; no leads; 12 terminals BLP10H610
Footprint for reflow soldering SOT1352-1 BLP10H610
PCB Design BLP10H610 (Data sheet) BLP10H610
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