数据手册DataSheet 下载：BSP130 N沟道垂直D-MOS逻辑电平FET.pdf
逻辑电平N沟道增强型场效应晶体管(FET)，采用使用垂直D-MOS技术的塑料封装。该产品仅设计适合用于计算、通信、消费电子和工业应用。
产品特点
| 产品应用
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订购型号
| 订购型号 | 封装 | Outline version | Reflow-/Wave soldering | 包装 | 产品状态 | 标示 | 订购器件的编号 |
| BSP130 | SC-73 (SOT223) | sot223_po | Reflow_Soldering_Profile Wave_Soldering_Profile | Tape reel smd | 激活 | BSP130 | BSP130,115( 9340 235 00115 ) |
品质、可靠性及RoHS化学成分
| 订购型号 | 订购器件的编号 | RoHS / RHF | 无铅开始日期 | EFR | IFR (FIT) | MTBF（小时） | 潮湿敏感度等级 | MSL LF |
| BSP130 | BSP130,115 |   | week 35, 2003 | 603.0 | 2.8 | 3.58E8 | 1 | 1 |
产品技术资料
- Power MOSFET single-shot and repetitive avalanche ruggedness rating BUK7M12-60E
- Understanding power MOSFET data sheet parameters BUK7M12-60E
- Failure signature of Electrical Overstress on Power MOSFETs BUK7M12-60E
- Understanding power MOSFET data sheet parameters BUK7K6R8-40E
- Broad small-signal MOSFET portfolio to suit a wide range of applications BSS84AKW
- BSP130 NXP Product Quality BSP130
- BSP130.07_03_2012 Spice parameter BSP130
- BSP130 SPICE model BSP130
- Tape reel SMD; standard product orientation 12NC ending 115 BUK7880-55A
- Tape reel SMD; standard product orientation 12NC ending 135 BUK7880-55
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Footprint for wave soldering SOT223 BLT81
- plastic surface-mounted package with increased heatsink; 4 leads BLT81
- Footprint for reflow soldering SOT223 BLT81
