BSP31; BSP32; BSP33: PNP中等功率晶体管
PNP中等功率晶体管，采用SOT223塑料封装。
NPN补充产品：BSP41和BSP43。
SOT223
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| PNP medium power transistors (REV 3.0) PDF (119.0 kB) BSP31_32_33 [English] | 26 Apr 1999 |
手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| Medium-power general-purpose transistors (REV 1.0) PDF (892.0 kB) 75017660 [English] | 26 May 2015 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| plastic surface-mounted package with increased heatsink; 4 leads (REV 1.0) PDF (198.0 kB) SOT223 [English] | 08 Feb 2016 |
包装 (1)
| 名称/描述 | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (189.0 kB) SOT223_115 [English] | 07 Nov 2012 |
可靠性与质量信息 (6)
| 名称/描述 | Modified Date |
|---|---|
| BSP31 NXP Product Quality (REV 1.2) PDF (74.0 kB) BSP31_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BSP31 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BSP31_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| BSP32 NXP Product Quality (REV 1.2) PDF (73.0 kB) BSP32_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BSP32 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BSP32_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| BSP33 NXP Product Quality (REV 1.2) PDF (74.0 kB) BSP33_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BSP33 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BSP33_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
支持信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
Design Support
- Letter Symbols - Transistors; General (REV 0.1) PDF LSYMTRA_1 5/7/1999
SPICE
- BSP31 SPICE model (REV 1.4) prm BSP31 7/22/2012
- BSP32 SPICE model (REV 1.4) prm BSP32 7/22/2012
- BSP33 SPICE model (REV 1.4) prm BSP33 7/22/2012
订购信息
| 型号 | 状态 |
|---|---|
| BSP33 | Active |
| BSP32 | Active |
| BSP31 | Active |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BSP32 | | SOT223 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q1/T1 | Active | BSP32,115 (9339 819 80115) | BSP32 | BSP32 |    | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| BSP31 | | SOT223 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q1/T1 | Active | BSP31,115 (9339 819 70115) | BSP31 | BSP31 | | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| BSP33 | | SOT223 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q1/T1 | Active | BSP33,115 (9339 819 90115) | BSP33 | BSP33 | | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- Medium-power general-purpose transistors BSR43
- BSP31 NXP Product Quality BSP31
- BSP31 NXP® Product Reliability BSP31
- BSP32 NXP Product Quality BSP32
- BSP32 NXP® Product Reliability BSP32
- BSP33 NXP Product Quality BSP33
- BSP33 NXP® Product Reliability BSP33
- Letter Symbols - Transistors; General PEMD16
- BSP31 SPICE model BSP31_BSP32_BSP33
- BSP32 SPICE model BSP32
- BSP33 SPICE model BSP33
- plastic surface-mounted package with increased heatsink; 4 leads BUK7880-55A
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 115 BUK7880-55A
- BLT81
