BSP60; BSP61; BSP62: PNP达林顿晶体管
PNP达林顿晶体管，采用SOT223塑料封装。NPN补充产品：BSP50、BSP51和BSP52。
工业开关应用，比如： -打印锤 -电磁阀 -继电器和灯具驱动器。 | BSP60_BSP61_BSP62: 产品结构框图 SOT223 |
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| PNP Darlington transistors (REV 5.0) PDF (120.0 kB) BSP60_61_62 [English] | 31 May 2001 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| plastic surface-mounted package with increased heatsink; 4 leads (REV 1.0) PDF (198.0 kB) SOT223 [English] | 08 Feb 2016 |
包装 (1)
| 名称/描述 | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (189.0 kB) SOT223_115 [English] | 07 Nov 2012 |
可靠性与质量信息 (6)
| 名称/描述 | Modified Date |
|---|---|
| BSP60 NXP Product Quality (REV 1.2) PDF (74.0 kB) BSP60_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BSP60 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BSP60_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| BSP61 NXP Product Quality (REV 1.2) PDF (74.0 kB) BSP61_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BSP61 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BSP61_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| BSP62 NXP Product Quality (REV 1.2) PDF (74.0 kB) BSP62_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BSP62 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BSP62_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
支持信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
Design Support
- Letter Symbols - Transistors; General (REV 0.1) PDF LSYMTRA_1 5/7/1999
- Power Derating Curves for SMDs; General (REV 0.1) PDF DERATSMD_1 5/7/1999
SPICE
- BSP60 SPICE model (REV 1.4) prm BSP60 7/22/2012
- BSP61 SPICE model (REV 1.4) prm BSP61 7/22/2012
- BSP62 SPICE model (REV 1.4) prm BSP62 7/22/2012
订购信息
| 型号 | 状态 |
|---|---|
| BSP61 | Active |
| BSP60 | Active |
| BSP62 | Active |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BSP62 | | SOT223 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q1/T1 | Active | BSP62,115 (9339 694 80115) | BSP62 | BSP62 |    | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| BSP61 | | SOT223 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q1/T1 | Active | BSP61,115 (9339 863 60115) | BSP61 | BSP61 | | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| BSP60 | | SOT223 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q1/T1 | Active | BSP60,115 (9339 863 50115) | BSP60 | BSP60 | | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- BSP60 NXP Product Quality BSP60
- BSP60 NXP® Product Reliability BSP60
- BSP61 NXP Product Quality BSP61
- BSP61 NXP® Product Reliability BSP61
- BSP62 NXP Product Quality BSP62
- BSP62 NXP® Product Reliability BSP62
- Letter Symbols - Transistors; General PEMD16
- Power Derating Curves for SMDs; General BST62
- BSP60 SPICE model BSP60_BSP61_BSP62
- BSP61 SPICE model BSP61
- BSP62 SPICE model BSP62
- plastic surface-mounted package with increased heatsink; 4 leads BUK7880-55A
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 115 BUK7880-55A
- BSP60_BSP61_BSP62
- BLT81
