BST60; BST61; BST62: PNP达林顿晶体管
PNP达林顿晶体管，采用SOT89塑料封装。
NPN补充产品：BST50、BST51和BST52。
BST60_BST61_BST62: 产品结构框图
BST60_BST61_BST62: 应用结构框图
SOT089
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| PNP Darlington transistors (REV 5.0) PDF (124.0 kB) BST60_61_62 [English] | 09 Dec 2004 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| plastic surface-mounted package; die pad for good heat transfer; 3 leads (REV 1.0) PDF (193.0 kB) SOT89 [English] | 08 Feb 2016 |
包装 (1)
| 名称/描述 | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (178.0 kB) SOT89_115 [English] | 28 Nov 2012 |
可靠性与质量信息 (6)
| 名称/描述 | Modified Date |
|---|---|
| BST60 NXP Product Quality (REV 1.2) PDF (74.0 kB) BST60_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BST60 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BST60_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| BST61 NXP Product Quality (REV 1.2) PDF (74.0 kB) BST61_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BST61 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BST61_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
| BST62 NXP Product Quality (REV 1.2) PDF (74.0 kB) BST62_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BST62 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BST62_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
Design Support
- Letter Symbols - Transistors; General (REV 0.1) PDF LSYMTRA_1 5/7/1999
- Power Derating Curves for SMDs; General (REV 0.1) PDF DERATSMD_1 5/7/1999
SPICE
- BST60 SPICE model (REV 1.4) prm BST60 7/22/2012
- BST61 SPICE model (REV 1.4) prm BST61 7/22/2012
- BST62 SPICE model (REV 1.4) prm BST62 7/22/2012
订购信息
| 型号 | 状态 |
|---|---|
| BST60 | Active |
| BST62 | Active |
| BST61 | Active |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BST62 | | SOT89 | Reel 7" Q1/T1 | Active | BST62,115 (9336 443 00115) | BS3 | BST62 |    | week 28, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 | |
| BST60 | | SOT89 | Reel 7" Q1/T1 | Active | BST60,115 (9336 442 80115) | BS1 | BST60 | | week 28, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 | |
| BST61 | | SOT89 | Reel 7" Q1/T1 | Active | BST61,115 (9336 442 90115) | BS2 | BST61 | | week 28, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- BST60 NXP Product Quality BST60
- BST60 NXP® Product Reliability BST60
- BST61 NXP Product Quality BST61
- BST61 NXP® Product Reliability BST61
- BST62 NXP Product Quality BST62
- BST62 NXP® Product Reliability BST62
- Letter Symbols - Transistors; General PEMD16
- Power Derating Curves for SMDs; General BST62
- BST60 SPICE model BST60_BST61_BST62
- BST61 SPICE model BST61
- BST62 SPICE model BST62
- plastic surface-mounted package; die pad for good heat transfer; 3 leads BZV49-C9V1
- Tape reel SMD; standard product orientation 12NC ending 115 BZV49-C9V1
- BZV49_SERIES
- BST60_BST61_BST62
- BFU590Q
