BTA2008W-600D：三象限Hi-Com三端双向可控硅
平面钝化高换向三象限三端双向可控硅采用SOT223表面贴装塑料封装。该“D系列”三端双向可控硅平衡了换向性能和栅极灵敏度要求，旨在连接包含微控制器的低功耗驱动器和逻辑IC。
特性和优势
应用
| 产品图片 |
关键参数
| Symbol | Parameter | Conditions | Min | Typ/Nom | Max | Unit |
|---|---|---|---|---|---|---|
| VDRM | repetitive peak off-state voltage | 600 | V | |||
| IT(RMS) | RMS on-state current | full sine wave; Tsp ≤ 111 °C | 0.8 | A | ||
| ITSM | non-repetitive peak on-state current | full sine wave; Tj(init) = 25 °C; tp = 20 ms | 9 | A | ||
| ITSM | non-repetitive peak on-state current | full sine wave; Tj(init) = 25 °C; tp = 16.7 ms | 9.9 | A | ||
| Tj | junction temperature | 125 | °C | |||
| IGT | gate trigger current | VD = 12 V; IT = 0.1 A; T2+ G+; Tj = 25 °C | 0.25 | 5 | mA | |
| IGT | gate trigger current | VD = 12 V; IT = 0.1 A; T2+ G-; Tj = 25 °C | 0.25 | 5 | mA | |
| IGT | gate trigger current | VD = 12 V; IT = 0.1 A; T2- G-; Tj = 25 °C | 0.25 | 5 | mA | |
| IH | holding current | VD = 12 V; Tj = 25 °C | 10 | mA | ||
| VT | on-state voltage | IT = 0.85 A; Tj = 25 °C | 1.35 | 1.6 | V | |
| dVD/dt | rate of rise of off-state voltage | VDM = 402 V; Tj = 125 °C; (VDM = 67% of VDRM); exponential waveform; gate open circuit | 200 | V/µs | ||
| dIcom/dt | rate of change of commutating current | VD = 400 V; Tj = 125 °C; IT(RMS) = 0.8 A; dVcom/dt = 10 V/µs; gate open circuit | 0.5 | A/ms |
封装与包装
| 型号 | 封装 | Outline version | Reflow-/Wave soldering | 包装 | 产品状态 | 标示 | 可订购的器件编号, (订购码 (12NC)) |
|---|---|---|---|---|---|---|---|
| BTA2008W-600D |  SC-73 (SOT223) | sot223_po | sot223_fr sot223_fw | Reel 11¼" Q1/T1 in LargePack | 量产 | Standard Marking | BTA2008W-600D,135( 9340 660 05135 ) |
引脚配置信息
| Pin | Symbol | Description | 外形简图 | 图形符号 |
|---|---|---|---|---|
| 1 | T1 | main terminal 1 |  |  |
| 2 | T2 | main terminal 2 | ||
| 3 | G | gate | ||
| 4 | mb | mounting base; connected to main terminal 2 |
无铅环保信息
| 型号 | 可订购的器件编号 | RoHS / RHF | 无铅转换日期 | 潮湿敏感度等级 | MSL LF |
|---|---|---|---|---|---|
| BTA2008W-600D | BTA2008W-600D,135 |   | Always Pb-free | 1 | 1 |
文档资料
| 档案名称 | 标题 | 类型 | 格式 | 日期 |
|---|---|---|---|---|
| BTA2008W-600D (中文) | 3Q Hi-Com Triac | Data sheet | 2014-08-14 | |
| 75017631 | Discretes Semiconductors Selection Guide 2015 | Selection guide | 2015-01-09 | |
| sot223_fr | Footprint for reflow soldering SOT223 | Reflow soldering | 2009-10-08 | |
| sot223_fw | Footprint for wave soldering SOT223 | Wave soldering | 2010-07-13 | |
| sot223_po | plastic surface-mounted package with increased heatsink; 4 leads | Outline drawing | 2009-10-08 | |
| SOT223_135 | Tape reel SMD; standard product orientation 12NC ending 135 | Packing | 2012-11-07 | |
| Reflow_Soldering_Profile | Reflow Soldering Profile | Reflow soldering | 2013-09-30 | |
| Wave_Soldering_Profile | Wave Soldering Profile | Wave soldering | 2013-09-30 |
订购信息
| 型号 | 订购码 (12NC) | 可订购的器件编号 |
|---|---|---|
| BTA2008W-600D | 9340 660 05135 | BTA2008W-600D,135 |
- 3Q Hi-Com Triac BTA2008W-600D
- Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
- Footprint for reflow soldering SOT223 BLT81
- Footprint for wave soldering SOT223 BLT81
- plastic surface-mounted package with increased heatsink; 4 leads BLT81
- Tape reel SMD; standard product orientation 12NC ending 135 BUK7880-55
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
