BYV430K-300P：Dual ultrafast power diode _ BDTIC 中国领先电子元器件代理商

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BYV430K-300P：Dual ultrafast power diode

Dual ultrafast power diode in a SOT1259 (3-lead TO-3P) plastic package.

特性和优势

Very low on-state loss
Fast switching
Soft recovery characteristic minimizes power consuming oscillations
High reverse surge capability
High thermal cycling performance
Low thermal resistance

应用

Output rectifiers
Welding machines
SMPS

产品图片

关键参数

Symbol	Parameter	Conditions	Min	Typ/Nom	Max	Unit
V_RRM	repetitive peak reverse voltage				300	V
I_F(AV)	average forward current	δ = 0.5 ; T_mb ≤ 105 °C; square-wave pulse			30	A
I_O(AV)	average output current	δ = 0.5 ; T_mb ≤ 105 °C; square-wave pulse; both diodes conducting			60	A
I_FRM	repetitive peak forward current	δ = 0.5 ; t_p = 25 µs; T_mb ≤ 105 °C; square-wave pulse			30	A
I_FSM	non-repetitive peak forward current	t_p = 10 ms; T_j(init) = 25 °C; sine-wave pulse; per diode			300	A
I_FSM	non-repetitive peak forward current	t_p = 8.3 ms; T_j(init) = 25 °C; sine-wave pulse; per diode			320	A
V_F	forward voltage	I_F = 30 A; T_j = 25 °C		1	1.25	V
V_F	forward voltage	I_F = 30 A; T_j = 150 °C		0.85	1	V
t_rr	reverse recovery time	I_F = 1 A; V_R = 30 V; dI_F/dt = 50 A/µs; T_j = 25 °C			55	ns
t_rr	reverse recovery time	I_F = 30 A; V_R = 200 V; dI_F/dt = 200 A/µs; T_j = 25 °C		42		ns
t_rr	reverse recovery time	I_F = 30 A; V_R = 200 V; dI_F/dt = 200 A/µs; T_j = 25 °C		74		ns

封装与包装

型号	封装	Outline version	Reflow-/Wave soldering	包装	产品状态	标示	可订购的器件编号, (订购码 (12NC))
BYV430K-300P	TO3P (SOT1259)	sot1259_po		Horizontal, Rail Pack	开发中	BYV430K-300P	BYV430K-300PQ( 9340 695 31127 )

引脚配置信息

Pin	Symbol	Description	外形简图	图形符号
1	A1	anode 1
2	K	cathode
3	A2	anode 2
mb	mb	mounting base; connected to cathode

无铅环保信息

型号	可订购的器件编号	RoHS / RHF	无铅转换日期	潮湿敏感度等级	MSL LF
BYV430K-300P	BYV430K-300PQ

文档资料

档案名称	标题	类型	格式	日期
sot1259_po	Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO3P	Outline drawing	pdf	2014-11-17

订购信息

型号	订购码 (12NC)	可订购的器件编号
BYV430K-300P	9340 695 31127	BYV430K-300PQ

Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO3P BYV430K-300P

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