AN11130 | Bias module for 50 V GaN demonstration boards | Application note | pdf | 2011-12-08 |
PCB_Design_CLF1G0035-50_1G0035S-50_Data-sheet | PCB Design CLF1G0035(S)-50 (Data sheet) | Design support | zip | 2014-08-18 |
fatigue_in_aluminum_bond_wires | Fatigue in aluminum bond wires | Mounting and soldering | pdf | 2009-10-08 |
NXP_RF_manual_19th_edition | RF Manual 19th edition: Application and design manual for High Performance RF products May 2015 | Other type | pdf | 2015-05-19 |
RFPower_Longevity_Overview | RF Power Longevity Overview | Other type | pdf | 2014-09-09 |
Application_Measurement_Report_CLF1G0035-50_3100-3500MHz_CA-029-12 | Application Measurement Report CLF1G0035-50 3100-3500 MHz CA-029-12 | Report | pdf | 2015-06-23 |
Application_Measurement_Report_CLF1G0035-50_2700-2900MHz_CA-136-12 | Application Measurement Report CLF1G0035-50 2700-2900 MHz CA-136-12 | Report | pdf | 2015-06-23 |
NXP_RFpower_Lib_V09p0 | RF Power Model Library for Microwave Office® | Simulation model | zip | 2014-11-11 |
NXP_RFpower_Manual_MWO_20141111 | RF Power Model Library Manual and Installation Instructions for Microwave Office® | Simulation model | pdf | 2014-11-11 |
CLF1G0035-50_ADS-2009_Model | CLF1G0035-50 ADS-2009 Model | Simulation model | zip | 2013-03-04 |
NXP_RFPower_Simulation_Example | RF Power Simulation Example for Microwave Office® | Simulation model | zip | 2012-06-11 |
CLF1G0035-50_ADS-2011_Model | CLF1G0035-50 ADS-2011 Model | Simulation model | zip | 2013-03-04 |
NXP_CLF1G0530_50_V0p15_Spar_Vgs_2n2_Vds_50_Idq_150mA_10Mto8GHz | CLF1G0035-50 50V 150mA S-parameter Data | S-parameter | s2p | 2012-04-04 |
sot467c_po | flanged ceramic package; 2 mounting holes; 2 leads | Outline drawing | pdf | 1999-12-27 |
SOT467C_112 | CDFM2; blister pack; standard product orientation 12NC ending 112 | Packing | pdf | 2012-11-30 |
sot467b_po | earless ceramic package; 2 leads | Outline drawing | pdf | 2012-05-08 |