The IP4233CZ6 is designed to protect Input/Output (I/O) ports that are sensitive to capacitive loads, such as Ethernet, from destruction by ElectroStatic Discharge (ESD).
The IP4233CZ6 incorporates two pairs of ultra low capacitance back-to-back diodes which protect components from ESD voltages as high as ±8 kV contact discharge according to IEC 61000-4-2, level 4.
The back-to-back diodes prevent negative clipping of AC signals and voltages below zero.
The IP4233CZ6 is fabricated using monolithic silicon technology integrating two ultra low capacitance back-to-back ESD protection diodes in a very small 6-lead SOT363 package
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| 型号 | 订购码 (12NC) | 可订购的器件编号 | 产品状态 | 封装 |
| IP4233CZ6 | 9340 626 14125 | IP4233CZ6,125 | 量产 | TSSOP6 (SOT363) |
| 型号 | 订购码 (12NC) | 可订购的器件编号 | 化学成分 |
| IP4233CZ6 | 9340 626 14125 | IP4233CZ6,125 | IP4233CZ6 |
| 档案名称 | 标题 | 类型 | 格式 |
| IP4233CZ6 | Ultra low capacitance ESD protection for Ethernet ports | Data sheet | |
| SC11_MARKING_4 | Marking codes Power Diodes | Other type | |
| SOT363_165 | TSSOP6; reel pack; reversed product orientation; 12NC ending 165 | Packing | |
| SOT363_115 | TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115 | Packing | |
| SOT363_135 | TSSOP6; Tape reel SMD; standard product orientation 12NC ending 135 | Packing | |
| SOT363_125 | Tape reel SMD; reversed product orientation 12NC ending 125 | Packing | |
| MAR_SOT363 | MAR_SOT363 Topmark | Top Marking | |
| sot363_fr | Footprint for reflow soldering SOT363 | Reflow soldering | |
| sot363_fw | Footprint for wave soldering SOT363 | Wave soldering | |
| sot363_po | plastic surface-mounted package; 6 leads | Outline drawing |